Forensic analysis of thermally stressed crimp connections

Abstract

Occasionally thermally stressed connectors have come back from the field with initial investigations confirming the crimp height was slightly above the upper design specification limit. Experimental designs were then conceived and conducted independently at both TE Connectivity and Whirlpool Corporation to investigate if the out-of-specification crimp heights were a result of the overheating in the area or potentially the cause of overheating in the area. The results were compared to the known mechanisms for joint degradation including stress relaxation, and cold welding breakdown including spring back analysis. The experimental investigation, coupled with comparison to current crimp models, helps further forensic investigations and the specific understanding of material behavior in crimped connectors.