2013
DOI: 10.1109/tcpmt.2012.2234830
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3-D Stacking of Ultrathin Chip Packages: An Innovative Packaging and Interconnection Technology

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Cited by 9 publications
(10 citation statements)
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“…The combination of both mechanical characteristics resulted in an A increased risk of die cracking during the lamination process. This effect has been reported in [9]. In order to control this risk of cracking, the topography can be reduced, thus creating a "Flat-UTCP" (Fig.…”
Section: Introductionmentioning
confidence: 76%
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“…The combination of both mechanical characteristics resulted in an A increased risk of die cracking during the lamination process. This effect has been reported in [9]. In order to control this risk of cracking, the topography can be reduced, thus creating a "Flat-UTCP" (Fig.…”
Section: Introductionmentioning
confidence: 76%
“…Priyabadini et al [9] characterized the stacking yield of the non-flat two-layered UTCP to be ƞ S ≈ 15% only, resulting in an overall yield ƞ eff of 7% following the simple equation on yield calculation (Eq. 1).…”
Section: B Utcp Stacking Processmentioning
confidence: 99%
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