3-D stacked thin-film photodetectors for multispectral detection applications

Monolithic integration of visible GaAs and near-infrared InGaAs for multicolor photodetectors by using high-throughput epitaxial lift-off toward high-resolution imaging systems

“…The monolithic integration of various PDs has an important advantage for future multi-functional PDs. First, it could alleviate the system volume for multicolor detection, which results in compact and low-power-consuming detection systems 12 . Secondly, thanks to freedom of choice about stacking materials, heterogeneously integrated multicolor PDs enable the detection of various wavelengths with a variety of materials having UV, visible, and IR regarding target applications with high performance.…”

“…Seo et al . demonstrated that the heterogeneous integration of a GaAs metal-semiconductor-metal (MSM) PD and an InGaAs MSM PD on a Si substrate by using a BCB adhesive bonding layer 12 . Each PD was vertically integrated and operated in its absorption regions.…”

Transfer of InP epilayers by wafer bonding

“…Optical links between fibre and OEIC [23][24][25] HBTs, RTDs Adhesive bonding of BCB, which also serves as a dielectric separation to the lossy Si Small thin-film modules for highfrequency handling on Si IC [26][27][28] wafers are fragile and available only in small sizes (with a price premium of US $30/sq.in). By implementing wafer bonding technology low-cost and large-area carrier substrates could be used to host InP-based materials.…”

“…Indirect bonding technologies that are easier to use include adhesive bonding or eutectic bonding, where intermediate layers of polymers [20][21][22][23][24][25][26][27][28]36], spin-on-glasses [37] and metals [17][18][19]38]. These methods may ease bonding of dies to wafers, reducing the amount of III-V material to be used on a Si wafer.…”

Multispectral pixel performance using a one-dimensional photonic crystal design

“…Applications such as multichemical detection, biological sensing, multispectral imaging, and spectroscopy call for specialized photodetectors that are capable of selectively sensing specific wavelengths simultaneously, namely, multispectral photodetection. Traditionally, multispectral capability has been achieved by several methods, including spatial registration ͑color filter array͒, 1,2 temporal registration ͑mechanical filter wheel͒, 3 tandem structure, 4 and quantum well photodetectors. 5,6 The first two methods complicate the pixel design and raise the issue of system reliability.…”