2016 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications (PAWR) 2016
DOI: 10.1109/pawr.2016.7440153
|View full text |Cite
|
Sign up to set email alerts
|

3.6 W/mm high power density W-band InAlGaN/GaN HEMT MMIC power amplifier

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

0
24
2

Year Published

2016
2016
2023
2023

Publication Types

Select...
6
2
1

Relationship

0
9

Authors

Journals

citations
Cited by 54 publications
(26 citation statements)
references
References 8 publications
0
24
2
Order By: Relevance
“…High-frequency GaN on SiC processes have been developed by HRL Lab since 2006 with the first W-band three-stage GaN MMIC reporting 25 dBm output power with 14% PAE at 80.5 GHz [165]. Recently, Fujitsu developed an 80 nm GaN HEMT process that observes among the highest power density of 3.6W/mm at W-band [166]. A 2 × 1.8 mm 2 MMIC shows a measured output power of 30.6 dBm with a small-signal gain of 18.9 dB and a peak PAE of 12.3% at 86 GHz.…”
Section: W-band (75-110 Ghz)mentioning
confidence: 99%
“…High-frequency GaN on SiC processes have been developed by HRL Lab since 2006 with the first W-band three-stage GaN MMIC reporting 25 dBm output power with 14% PAE at 80.5 GHz [165]. Recently, Fujitsu developed an 80 nm GaN HEMT process that observes among the highest power density of 3.6W/mm at W-band [166]. A 2 × 1.8 mm 2 MMIC shows a measured output power of 30.6 dBm with a small-signal gain of 18.9 dB and a peak PAE of 12.3% at 86 GHz.…”
Section: W-band (75-110 Ghz)mentioning
confidence: 99%
“…Since today's base station PAs require rather high OUT , they are largely designed in low-cost silicon LDMOS (Laterally Diffused MOSFETs) for sub-3.5 GHz bands, and in GaAs or GaN at higher frequencies, depending on the exact OUT requirements [11,12]. For example, GaN devices are capable of operating at a RF power density of 6-8 W/mm of gate periphery at 4G cellular bands and can deliver an impressive power density of 3.6 W/mm at 86 GHz in continuous-wave (CW) operation [11]. In a separate work, OUT of 3.6 Watt at 83 GHz was achieved in pulse mode [11] that siliconbased PA technologies (LDMOS, SiGe, and CMOS) simply cannot match.…”
Section: The Choice Of Device Technologies 5g Pamentioning
confidence: 99%
“…For example, GaN devices are capable of operating at a RF power density of 6-8 W/mm of gate periphery at 4G cellular bands and can deliver an impressive power density of 3.6 W/mm at 86 GHz in continuous-wave (CW) operation [11]. In a separate work, OUT of 3.6 Watt at 83 GHz was achieved in pulse mode [11] that siliconbased PA technologies (LDMOS, SiGe, and CMOS) simply cannot match. However, silicon-based RF PAs do have the advantages in offering higher monolithic integration with added functionalities (e.g., on-chip digital control/selection Wireless Communications and Mobile Computing 3 OUT requirements per PA (i.e., <20 dBm), which means they could be realizable by silicon-based PAs.…”
Section: The Choice Of Device Technologies 5g Pamentioning
confidence: 99%
“…GaN HEMTs with good performance for application in W band have been reported [ 2 , 3 , 4 , 5 ]. Also, over the past few years, several GaN HEMT based monolithic microwave integrated circuits (MMICs) up to W-band have been developed, due to their applications in high speed wireless communications or radar systems [ 6 ]. A GaN MMIC power amplifier at 91 GHz was reported to have 1.7 W output power that is associated with 11% power added efficiency [ 7 ].…”
Section: Introductionmentioning
confidence: 99%