2020
DOI: 10.1109/tmtt.2020.2989792
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A Review of Technologies and Design Techniques of Millimeter-Wave Power Amplifiers

Abstract: This paper reviews the state-of-the-art of millimeterwave power amplifiers, focussing on broadband design techniques. An overview of the main solid-state technologies is provided, including Si, GaAs, GaN and other III-V materials, and both field-effect and bipolar transistors. The most popular broadband design techniques are introduced, before critically comparing through the most relevant design examples found in the scientific literature. Given the wide breadth of applications that are foreseen to exploit th… Show more

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Cited by 128 publications
(38 citation statements)
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References 183 publications
(227 reference statements)
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“…High power outputs have been demonstrated by Indium Phosphide (InP) devices throughout the D-band, as shown in Fig. 7, and future GaN devices are expected to reach even higher powers due to the high breakdown voltage of the material [101].…”
Section: Iii-v Technologiesmentioning
confidence: 99%
“…High power outputs have been demonstrated by Indium Phosphide (InP) devices throughout the D-band, as shown in Fig. 7, and future GaN devices are expected to reach even higher powers due to the high breakdown voltage of the material [101].…”
Section: Iii-v Technologiesmentioning
confidence: 99%
“…Emerging communication systems are moving at high frequency, beyond the sub‐6 GHz bands 1‐4 . The currently available technologies that allow electronic circuits to operate at higher frequencies, such as Silicon (Si), Gallium Arsenide (GaAs) and Gallium Nitride (GaN), do not provide enough power at device level to comply with the communication systems requirements for power amplifiers (PAs).…”
Section: Introductionmentioning
confidence: 99%
“…There are two ways of combining power at MMIC level, the parallel (current summing) and series (voltage summing) connection of several devices 4 . Current combining is widely adopted for its simplicity, but has some clear disadvantages from the design standpoint, especially in terms of impedance level, which theoretically decreases by a factor N with respect to the optimum impedance of the individual device, when N devices are combined.…”
Section: Introductionmentioning
confidence: 99%
“…In this work, we have designed and fabricated a costeffective co-site LNPA using GaAs to reduce these interference problems. Gallium Arsenide (GaAs) is a wellestablished technology for the implementation of highfrequency Power Amplifiers (PAs) [13]. Our design of a cosite LNPA for 5G applications is based on a standard 0.25µm GaAs pHEMT technology -with a cutoff frequency (f T ) of 70 GHz and a maximum transconductance (g m ) of 800 mS/mm.…”
Section: Introductionmentioning
confidence: 99%