“…Traditionally, these RF SPDT switches are being realized using III-V semiconductor technologies [11,12,13,14], since they offer high isolation and high P −1 , and introduce low insertion loss. But fabrication of multi-functional chips (MFCs) or core-chips using these processes is expensive and poses challenges in integration.. To minimize the chip area, a shunt nMOS SPDT switch is adopted in [3], however, it has poor power handling capability. In silicon circuits, to overcome the disadvantage of low-power handling capability, saturated or reverse saturated HBTs [15,16,17] are used for designing millimetre wave SPDT switches and /4 transmission line.…”