25.8 Gb/s Submillimeter Optical Data Link Module for Smart Catheters

Abstract

The digitization of smart catheters will dramatically increase the demand for reliable and high data transmission in the distal tips. Optical fiber is a good candidate to provide high-speed data transmission. However, the extremely small size of the smart catheter tip, with less than a few millimeters in diameter, hampers the integration of optical fiber connections in the catheter tip. Our work presents a stand-alone optical data link module (ODLM) with a dimension of 240 µm  280 µm  420 µm for use in a 1 mm diameter intravascular ultrasound (IVUS) smart catheter. The fabrication of the ODLM is based on the Flex-to-Rigid (F2R) integration technology. In the ODLM, the flexible interconnects reroute the electrical contacts of the flip-chipped vertical-cavity sur-face-emitting laser (VCSEL) to the side of the device. This design enables the ODLM to be mounted on a flex-PCB and fit into a 200-300 µm gap in the IVUS catheter tip. An optical fiber that runs parallel to the catheter shaft is self-aligned to a commercially available VCSEL by inserting it into the through-silicon hole (TSH) of the ODLM. Clear eye diagrams prove the stand-alone ODLM can transmit 25.8 Gb/s, 2 31 -1 Pseudo-Random Binary Sequence (PRBS) when driven through a high-speed bias-tee. The BER test indicates that error-free operation can be achieved at an optical output of around -4 dBm.

A photonic MEMS interposer to solve electronic and optical assembly challenges

“…It enables the integration of multiple cameras while keeping a slim design; it allows a tighter density of functionality while maintaining a high level of reliability and more form factor degrees of freedom; it makes the next generation of foldable or deformable phones possible. And this fold or roll approach electromechanical system (MEMS) building block based on the Philips MEMS Foundry F2R platform allowed the miniaturization of an optical data link module (ODLM), resolving form factor requirements to fit into the tip of a guidewire [1]. This MEMS interposer enabled the integration challenges to be overcome while simplifying the assembly and maintaining the high performance of the ODLM.…”