A photonic MEMS interposer to solve electronic and optical assembly challenges

Abstract

Photonic applications often face industry‐specific assembly requirements that can be challenging to overcome. There is a need for micron‐accurate alignment, device miniaturization and integration in challenging form factors. Special materials and packaging must be developed for the best performance of the devices in exacting environmental conditions. In the medical field, these requirements are additionally complicated by the demanding ISO 13485 regulations. The article demonstrates how solutions are found in a combination of new and existing technology in microelectronics packaging and now made suitable for photonics.