2019 IEEE International Solid- State Circuits Conference - (ISSCC) 2019
DOI: 10.1109/isscc.2019.8662415
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24.2 A 7nm 2.1GHz Dual-Port SRAM with WL-RC Optimization and Dummy-Read-Recovery Circuitry to Mitigate Read- Disturb-Write Issue

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Cited by 11 publications
(3 citation statements)
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“…If read/write operations are performed simultaneously to generate conflicts, it will lead to read and write operations for the same memory The problem of read/write conflict has been extensively studied in the field of integrated circuits. For instance by Suzuki et al [23] introduced a novel cell bias technique to mitigate the effect of read/write interference; [24] enhanced the WordLine-Resistance/Capacitor and refined the logic to reduce the read/write conflict issue. Based on the theoretical analysis, this paper proposes an optimized circuit structure design to address the challenge of read and write conflicts.…”
Section: Read/write Conflict and Timing Error Mechanism Analysismentioning
confidence: 99%
“…If read/write operations are performed simultaneously to generate conflicts, it will lead to read and write operations for the same memory The problem of read/write conflict has been extensively studied in the field of integrated circuits. For instance by Suzuki et al [23] introduced a novel cell bias technique to mitigate the effect of read/write interference; [24] enhanced the WordLine-Resistance/Capacitor and refined the logic to reduce the read/write conflict issue. Based on the theoretical analysis, this paper proposes an optimized circuit structure design to address the challenge of read and write conflicts.…”
Section: Read/write Conflict and Timing Error Mechanism Analysismentioning
confidence: 99%
“…In other words, the beta ratio of M3D SRAM cell can be adjusted without area penalty by changing the numbers of stacked MoS2 nanosheet FETs. The metal interconnect resistance increases significantly as technology node scales beyond 7nm node [1][2]. In order to release the impact of increased interconnect resistance, the metal line length of SRAM cell needs to be reduced.…”
Section: Stacked 2d Materials Fets M3d Sram Cellmentioning
confidence: 99%
“…The growing demand for AI applications is a major driver for reducing power and continued area scaling in SoCs (System-on-Chips). Continued scaling of the transistor and metal interconnection geometry is accompanied by the increased wire routing resistance which degrades the SRAM performance and array efficiency in advanced technology nodes [1][2]. The buried power SRAM [3] has been proposed to lower the bitline (BL) and wordline (WL) resistance and thereby enhances the write margin and performance even though the total capacitance per cell has been increased.…”
Section: Introductionmentioning
confidence: 99%