Materials for Bioresorbable Radio Frequency Electronics

Hwang, Suk Won; Huang, Xian; Seo, Jung‐Hun; Jun, Sangook; Stanley, Kim; Hage-Ali, Sami; Chung, Hyun‐Joong; Tao, Hu; Omenetto, Fiorenzo G.; Ma, Zhenqiang; Li, Jinghua

doi:10.1002/adma.201300920

Cited by 191 publications

(222 citation statements)

References 13 publications

Supporting

Mentioning

218

Contrasting

Order By: Relevance

“…[12][13][14] One potential route to reduce electronic waste streams is to build the electronics using materials that can naturally degrade into biologically and environmentally benign end products on timescales that exceed desired device lifetimes. [ 15 ] Recently developed classes of 'transient' electronic components, such as transistors, [ 16 ] mechanical energy harvesters, [ 17 ] electrodes, [ 15 ] and primary batteries [ 18 ] as well as functional circuits for radio transmission and power harvesting [ 19 ] offer these characteristics signal remains unchanged at ∼15 dBm throughout this range ( Figure S2e). As the distance between the receiving antenna and the circuit increases from 0.7 to 4.2 m (Figure S2f), the measurement system ( Figure S2a) records a power loss from −6.4 to −20.5 dBm.…”

mentioning

confidence: 96%

Biodegradable Materials for Multilayer Transient Printed Circuit Boards

et al. 2014

Self Cite

View full text Add to dashboard Cite

show abstract

mentioning

confidence: 96%

Biodegradable Materials for Multilayer Transient Printed Circuit Boards

et al. 2014

Self Cite

View full text Add to dashboard Cite

show abstract

“…The results enable bioresorbable implants that bypass secondary surgical procedures for extraction, environmental sensors that avoid the need for retrieval and collection after use, and compostable electronics that eliminate costs and risks associated with recycling operations (24-26). Specific examples in the research literature include simple passive and active components (e.g., resistors, Si transistors), complementary metal-oxide-semiconductor (CMOS) inverters and their logic gates, sensors and detectors, energy storage devices and harvesters, and wireless RF power scavengers (27)(28)(29)(30). The most recent results show, in fact, that transient electronics can be built using conventional tools in a CMOS fabrication environment, with device and circuit designs that incorporate biodegradable materials, such as Si, SiO 2 , and W, with only minute amounts of nondegradable materials, such as Significance Bioresorbable electronic systems have the potential to create important new categories of technologies, ranging from temporary biomedical implants to environmentally benign, green consumer devices.…”

mentioning

confidence: 99%

Materials and processing approaches for foundry-compatible transient electronics

Chang

Fang

Bower³

et al. 2017

Proc. Natl. Acad. Sci. U.S.A.

Self Cite

View full text Add to dashboard Cite

Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-theart silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.soft electronics | biodegradable electronics | transfer printing | undercut etching | hydrolysis S emiconductor technology is increasingly essential to nearly all aspects of modern society, with projections of market sizes that will exceed $7 trillion in 2017, equivalent to 10% of the world's gross domestic product (1-4). The rapid and accelerating pace of innovation in this area leads to increases in the frequency with which consumers upgrade their devices, thereby contributing to the production of >50 million tons of electronic waste (e-waste) each year (5, 6). Furthermore, the anticipated emergence of electronics for internet-of-things applications, along with the continued proliferation of radio frequency (RF) identification tags and other high-volume electronic goods, create daunting challenges with the management of this e-waste (7, 8). These considerations motivate research into forms of electronics that can degrade naturally into the environment to harmless end products. Such technology is also of interest for other, unique classes of applications, ranging from biodegradable, temporary electronic implants to hardware secure data systems and unrecoverable, field-deployed devices (9-12). Sometimes referred to collectively as transient electronics, these types of devices can be constructed by using designer materials, such as specially formulated polymers or natural products (13-16), or clever combinations of established materials, well-aligned to existing ...

show abstract

“…[18][19][20] Thus, it enables us to demonstrate high performance flexible CMOS TFTs such as flexible RF TFTs, high sensitivity light sensors, bio-medical devices, and environment-friendly devices. [12][13][14][15][16][21][22][23][24] Although these demonstrations were very successful on their own, all of them have been fabricated using CMOS technology that is inadequate to handle high power signals or to satisfy more functionally advanced flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

“…[9][10][11][12][13] Up to date, all the Si-based thinfilm transistors (TFTs) have been realized with CMOS technology because of their simple structure and process. [12][13][14] However, as more functions are required in future flexible electronic applications (i.e., advanced bioelectronic systems or flexible wireless power applications), [15][16][17] an integration of functional devices in one flexible substrate is needed to handle complex signals and/or various power levels. In light of the development in and wide applications of the rigid-chip-based semiconductor transistors, a mechanically flexible BiCMOS platform will also be able to open a new pathway in fulfilling the needs of advanced flexible electronics.…”

Section: Introductionmentioning

confidence: 99%

High-performance flexible BiCMOS electronics based on single-crystal Si nanomembrane

et al. 2017

Self Cite

View full text Add to dashboard Cite

In this work, we have demonstrated for the first time integrated flexible bipolar-complementary metal-oxide-semiconductor (BiCMOS) thin-film transistors (TFTs) based on a transferable single crystalline Si nanomembrane (Si NM) on a single piece of bendable plastic substrate. The n-channel, p-channel metal-oxide semiconductor field-effect transistors (N-MOSFETs & P-MOSFETs), and NPN bipolar junction transistors (BJTs) were realized together on a 340-nm thick Si NM layer with minimized processing complexity at low cost for advanced flexible electronic applications. The fabrication process was simplified by thoughtfully arranging the sequence of necessary ion implantation steps with carefully selected energies, doses and anneal conditions, and by wisely combining some costly processing steps that are otherwise separately needed for all three types of transistors. All types of TFTs demonstrated excellent DC and radio-frequency (RF) characteristics and exhibited stable transconductance and current gain under bending conditions. Overall, Si NM-based flexible BiCMOS TFTs offer great promises for high-performance and multifunctional future flexible electronics applications and is expected to provide a much larger and more versatile platform to address a broader range of applications. Moreover, the flexible BiCMOS process proposed and demonstrated here is compatible with commercial microfabrication technology, making its adaptation to future commercial use straightforward.

show abstract

Materials for Bioresorbable Radio Frequency Electronics

Cited by 191 publications

References 13 publications

Biodegradable Materials for Multilayer Transient Printed Circuit Boards

Biodegradable Materials for Multilayer Transient Printed Circuit Boards

Materials and processing approaches for foundry-compatible transient electronics

High-performance flexible BiCMOS electronics based on single-crystal Si nanomembrane

Contact Info

Product

Resources

About