Abstract:The fabless semiconductor companies should take more responsibility for the global climate change when more and more consumer electronics are being produced. Under the trade-off between the signal quality of DDR3 memory and power consumption, the chip-package-board co-simulations were taken in the frequency domain up to 10 GHz and the time domain at 2 Gb/s to compare two types of channel designs. Results indicated that the proposed channel using the 2.5-layer PCB achieved the lower power consumption with accep… Show more
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