From SI, PI, EMI Design, Verification, to Package, Board, and Channel Intellectual Property

Chen, Nansen

doi:10.1109/eptc56328.2022.10013193

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022

DOI: 10.1109/eptc56328.2022.10013193

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From SI, PI, EMI Design, Verification, to Package, Board, and Channel Intellectual Property

Nansen Chen

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From SI, PI, EMI Design, Verification, to Package, Board, and Channel Intellectual Property

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