2017
DOI: 10.1002/mop.30343
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2.4‐GHz CMOS linear power amplifier for IEEE 802.11N WLAN applications

Abstract: In this work, we design a linear CMOS power amplifier with a spiral‐type output transformer for IEEE 802.11n WLAN applications. We conduct studies to identify the proper output transformer and power stage structures for linear CMOS power amplifiers. The power amplifier is composed of a single differential‐pair for the power stage to mitigate the stability problems that frequently arise in high gain linear power amplifiers. Additionally, we investigate the output matching network using a spiral‐type output tran… Show more

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Cited by 6 publications
(4 citation statements)
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References 15 publications
(14 reference statements)
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“…LNA and PA designs can be with chips as well as with transistors such as Complementary Metal Oxide Semiconductor (CMOS), heterojunction bipolar transistor (HBT), field-effect transistor (FET), High-electronmobility transistor (HEMT) and Pseudomorphic High Electron Mobility Transistor (pHEMT) [5][6]; the biasing is prominent for the selection [7]. The waves emitted from the antenna have to be 1556 amplified first with PA and it is essential to form a stable [8] and efficient [9] circuit according to practice. While creating the PA circuit, which class will be applied may also be selected according to the level of efficiency and linearity [10].…”
Section: Introductionmentioning
confidence: 99%
“…LNA and PA designs can be with chips as well as with transistors such as Complementary Metal Oxide Semiconductor (CMOS), heterojunction bipolar transistor (HBT), field-effect transistor (FET), High-electronmobility transistor (HEMT) and Pseudomorphic High Electron Mobility Transistor (pHEMT) [5][6]; the biasing is prominent for the selection [7]. The waves emitted from the antenna have to be 1556 amplified first with PA and it is essential to form a stable [8] and efficient [9] circuit according to practice. While creating the PA circuit, which class will be applied may also be selected according to the level of efficiency and linearity [10].…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, many studies related to the CMOS power amplifier were conducted with fully integrated RF systems to reduce the unit cost of production . However, given that the CMOS has a low breakdown voltage when compared to the HBT, a large drain voltage swing contributes to active device stress .…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, many studies related to the CMOS power amplifier were conducted with fully integrated RF systems to reduce the unit cost of production. [1][2][3][4] However, given that the CMOS has a low breakdown voltage when compared to the HBT, a large drain voltage swing contributes to active device stress. 5,6 The amplitude of the drain voltage of a power amplifier is several times the supply voltage; this degrades the reliability of the CMOS power amplifier.…”
Section: Introductionmentioning
confidence: 99%
“…One of the most popular structures which can be used to overcome the problems associated with CMOS power amplifiers is differential structure, as shown in Fig. 1 [17][18][19]. Since differential structure provides a virtual ground in an integrated CMOS power amplifier, the gain reduction problem induced by the parasitic inductance and bond wires is easily solved.…”
Section: Introductionmentioning
confidence: 99%