Metrology, Inspection, and Process Control for Microlithography XVIII 2004
DOI: 10.1117/12.535214
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193-nm resist roughness characterization and process propagation investigation using a CD-SEM

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Cited by 9 publications
(3 citation statements)
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“…This better process control is mainly the result of averaging over nearest neighbors and therefore excluding most of the random process variations of individual features. Examples for random CD fluctuations are local footing and rounding of resist structures, variations in the taper angle after etch, line edge roughness and line width roughness [6,7].…”
Section: Influence Of Averaging On Random CD Variationsmentioning
confidence: 99%
“…This better process control is mainly the result of averaging over nearest neighbors and therefore excluding most of the random process variations of individual features. Examples for random CD fluctuations are local footing and rounding of resist structures, variations in the taper angle after etch, line edge roughness and line width roughness [6,7].…”
Section: Influence Of Averaging On Random CD Variationsmentioning
confidence: 99%
“…This is true for transistor gate roughness which does not scale with the critical dimension of the transistor [2][3][4][5]. It is important for the electrical characteristics of transistors [2][3][4][6][7][8][9][10][11], the capacitance of thin insulating films [12], the light scattering in optoelectronic devices [13], the flow in microchannels [14], the adsorption of proteins on surfaces [15,16], the wettability [17] of surfaces and many other applications.…”
Section: Introductionmentioning
confidence: 99%
“…Αυτό επιβεβαιώθηκε αργότερα από πιο εκτεταμένες μελέτες όπως (π.χ.) αυτές των Marschner et al (Marschner, et al 2004) και των Constantoudis et al (Constantoudis, et al 2005). Όπως φαίνεται από την αντίστοιχη, απλοποιημένη εκδοχή της εξίσωσης 5.3, οι τιμές των LER και του LWR είναι ανάλογες μεταξύ τους:…”
Section: και (Patsis and Gogolides 2005)unclassified