2013
DOI: 10.4028/www.scientific.net/msf.740-742.978
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15 kV, Large Area (1 cm<sup>2</sup>), 4H-SiC p-Type Gate Turn-Off Thyristors

Abstract: In this paper, we report our recently developed 1 cm2, 15 kV SiC p-GTO with an extremely low differential on-resistance (RON,diff) of 4.08 mΩ•cm2 at a high injection-current density (JAK) of 600 ~ 710 A/cm2. The 15 kV SiC p-GTO was built on a 120 μm, 2×1014/cm3 doped p-type SiC drift layer with a device active area of 0.521 cm2. Forward conduction of the 15 kV SiC p-GTO was characterized at 20°C and 200°C. Over this temperature range, the RON,diff at JAK of 600 ~ 710 A/cm2 decreased from 4.08 mΩ•cm2 at 20°C to… Show more

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Cited by 35 publications
(20 citation statements)
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“…Research-level SiC device prototypes with blocking voltage capabilities above 15 kV have been demonstrated using floating field/guard rings (FFR/FGR) [6], [13]- [15], multi-zone (MZ)-JTE [16]- [18], optimized implantationfree (O)-JTE [19], negative bevel based (NB)-JTE [20], [21], and space-modulated (SM)-JTE [7]- [10], [22] termination structures, offering each design concept with its specific set of advantages and disadvantages. The floating guard-ring structure is processed without additional manufacturing steps but requires more than 100 rings for devices with > 10 kV blocking voltage capability [23], [24].…”
Section: Assessment Of Junction Termination Extension Structures For Ultrahigh-voltage Silicon Carbidementioning
confidence: 99%
“…Research-level SiC device prototypes with blocking voltage capabilities above 15 kV have been demonstrated using floating field/guard rings (FFR/FGR) [6], [13]- [15], multi-zone (MZ)-JTE [16]- [18], optimized implantationfree (O)-JTE [19], negative bevel based (NB)-JTE [20], [21], and space-modulated (SM)-JTE [7]- [10], [22] termination structures, offering each design concept with its specific set of advantages and disadvantages. The floating guard-ring structure is processed without additional manufacturing steps but requires more than 100 rings for devices with > 10 kV blocking voltage capability [23], [24].…”
Section: Assessment Of Junction Termination Extension Structures For Ultrahigh-voltage Silicon Carbidementioning
confidence: 99%
“…Lastly, a heavily doped (>1e19cm -3 ) p+ anode layer of thickness 2 µm was grown. Further design details of the devices characterized and evaluated in this research has been published by Wolfspeed and ARL and can be found in the following references [3][4][5].…”
Section: Device Structurementioning
confidence: 99%
“…The development of wide bandgap semiconductors like SiC has attracted great attention due to its superior material properties over Si, making devices with breakdown voltage higher than 10 kV easily achievable. Among the high-voltage SiC power devices, the gate turn-off (GTO) thyristors can achieve the best current handling capability with very lower forward drop [2] [3]. This is clearly shown in Fig.1 where the comparison of 15-kV p-GTO, n-IGBT and n-MOSFET, all based on 4H-SiC and fabricated by Cree, are provided.…”
Section: Introductionmentioning
confidence: 97%
“…The total device chip area is 2cm 2 with an active conducting area of 0.53cm 2 . Details on the device fabrication can be found in [2] [3]. …”
Section: Introductionmentioning
confidence: 99%