2018 IEEE International Electron Devices Meeting (IEDM) 2018
DOI: 10.1109/iedm.2018.8614606
|View full text |Cite
|
Sign up to set email alerts
|

14ns write speed 128Mb density Embedded STT-MRAM with endurance>1010 and 10yrs retention@85°C using novel low damage MTJ integration process

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
11
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 42 publications
(11 citation statements)
references
References 7 publications
0
11
0
Order By: Relevance
“…The STT-based spintronic devices have already demonstrated their commercial value as recently announced mass production of the eMRAM to replace the existing NOR Flash embedded memories (Sato et al, 2018a are naturally expected to complement and extend nonvolatile memory applications as SOT-MRAM. In addition, as human society steps into the era of big data, artificial intelligence, quantum computing, and internet of things, there are also promising opportunities for the nonvolatile spin-orbitronic devices with ultrafast dynamics controllability, excellent energy efficiency, almost unlimited endurance, outstanding stability, radiation resistance, and validated CMOS-compatibility to be explored in related emerging applications as exampled in Figure 2.…”
Section: Emerging Spin-orbitronic Devices Applicationsmentioning
confidence: 99%
“…The STT-based spintronic devices have already demonstrated their commercial value as recently announced mass production of the eMRAM to replace the existing NOR Flash embedded memories (Sato et al, 2018a are naturally expected to complement and extend nonvolatile memory applications as SOT-MRAM. In addition, as human society steps into the era of big data, artificial intelligence, quantum computing, and internet of things, there are also promising opportunities for the nonvolatile spin-orbitronic devices with ultrafast dynamics controllability, excellent energy efficiency, almost unlimited endurance, outstanding stability, radiation resistance, and validated CMOS-compatibility to be explored in related emerging applications as exampled in Figure 2.…”
Section: Emerging Spin-orbitronic Devices Applicationsmentioning
confidence: 99%
“…Another well-established area expanding beyond the development of NV logic is the NV STT-MRAM memory, and recently 1 Gb STT-MRAM (ST-DDR4) chip family named as EMD4E001G was manufactured by Everspin technologies [41]. Due to the latest progress in MRAM fabrication [358,359], ultra-high-density embedded STT-MRAM has opened the way for its use in industrial-grade microcontroller unit (MCU) and IoT applications [360]. MTJ with a high-performance MgO barrier can also be used for flexible wearable spintronic applications, especially for biomedical sensing in early disease diagnosis of HIV-1 antigen p24 [361], low field sensitive sensor for neuronal signal detection, and design of versatile sensors for omnidirectional detection of skin decease.…”
Section: Circuit Perspective-various Hybrid Cmos/mtjmentioning
confidence: 99%
“…STT-MRAM can be integrated in a broad range of applications, from Internet-of-Things to automotive applications [ 3 ] and last level caches [ 8 , 9 , 10 ]. Recently, 1Gb standalone [ 11 ] and embedded STT-MRAM solutions [ 2 , 4 , 12 , 13 ] have been reported and STT-MRAM operation with a timing of a few nanoseconds has been demonstrated [ 8 ]. However, in order to further reduce the timing below the nanosecond range, the required current density becomes quite large.…”
Section: Introductionmentioning
confidence: 99%