The Charge Trap Transistor (CTT) technology is an emerging memory solution that turns as-fabricated high-k /metal gate (HKMG) logic transistors into secure, embedded non-volatile memory (eNVM) elements with excellent data retention and operation capability at military grade temperatures. In other words, the CTTs offer a completely process-free and mask-free eNVM solution for advanced HKMG CMOS technology nodes. In this letter, bitcell design to enhance programming efficiency and modeling of the charge trapping behavior of CTTs in 14 nm FinFET technology is discussed. Index Terms-Charge Trap Transistor (CTT), embedded non-volatile memory (eNVM), process-free, mask-free, high-k /metal gate (HKMG), CMOS. I. INTRODUCTION W HILE need for on-chip non-volatile memory in VLSI technologies continues to grow rapidly, the options have been limited due to integration and scaling challenges as well as operational voltage incompatibilities. eFUSE and anti-fuse [1] technologies require high voltages which are logic incompatible and also face scaling challenges. Other memory technologies like MONOS (metal-oxide-nitride-oxidesilicon) [2] and MRAM (magnetoresistive random access memory) [3] require additional complex processes and masks. Unlike the aforementioned memories, CTTs offer an embedded non-volatile memory (eNVM) solution that requires absolutely no additional processes or masks, operates at logiccompatible voltages (∼2V maximum), and is scalable. Chip configuration, repair at wafer and module test and in the field, firmware, and performance tailoring are some applications of CTT eNVM. CTTs also find their applications in security enhancements such as chip ID, authentication, and encryption key storage.