100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

Senkal, Doruk; Askari, Sina; Ahamed, Mohammed Jalal; Ng, Eldwin J.; Hong, Vu A.; Yang, Yushi; Ahn, Chang-Nam; Kenny, Thomas W.; Shkel, Andrei M.

doi:10.1109/memsys.2014.6765564

Cited by 64 publications

(28 citation statements)

References 6 publications

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“…A Toroidal Ring Gyroscope (TRG) with Q-factor of 100k at 70 kHz central frequency and 1.7 mm diameter was used for the experiments; the device consists of an outer ring anchor surrounding a distributed mass system and central electrode architecture [7], Fig. 1.…”

Section: Gyroscope Architecturementioning

confidence: 99%

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Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability

Senkal

Hong

et al. 2015

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

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In this paper, we report parametric drive of a MEMS rate integrating gyroscope for reduction of drifts induced by drive electronics. A Toroidal Ring Gyroscope (TRG) with 100k Q-factor at 1760 µm diameter was fabricated in epitaxial silicon encapsulation (EpiSeal) process. Device was operated in rate integrating mode using a FPGA based control system. In contrast to the conventional amplitude control architecture, the central star electrode of the gyroscope, connected to a single drive channel was utilized for amplitude control of both modes. Due to the parametric pumping effect, energy added to each (x and y) mode is proportional to the existing amplitude of the respective mode. As a result, errors associated with finding the orientation of the standing wave and x-y drive gain drift are bypassed. Compared to conventional x-y drive architecture, as high as 14x improvement in scale factor stability was observed with parametric pumping, resulting in better than 20 ppm scale factor stability without any compensation or temperature stabilization.

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Section: Gyroscope Architecturementioning

confidence: 99%

“…This decoupling mitigates anchor losses into the substrate and prevents die/package stresses from propagating into the vibratory structure. [7]. Device consists of an outer ring anchor, distributed suspension system and an inner electrode assembly.…”

Section: Gyroscope Architecturementioning

confidence: 99%

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability

Senkal

Hong

et al. 2015

2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Self Cite

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“…This permits a significant reduction in TIMU size, without compromising in sensor performance, [9][10][11][12]. In this work, we report the most recent developments in the "origami-like" MEMS paradigm, demonstrating a <50 mm 3 TIMU with 7 single axis high-aspect ratio sensors and thruwafer interconnects.…”

Section: Introductionmentioning

confidence: 95%

Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration

Efimovskaya

Senkal

Askari

et al. 2015

2015 IEEE International Symposium on Inertial Sensors and Systems (ISISS) Proceedings

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This paper reports a prototype of miniature, <50 mm 3 , Timing and Inertial Measurement Unit (TIMU), implemented utilizing a Folded MEMS concept. The approach is based on a wafer-level fabrication of high aspect ratio single-axis sensors, interconnected by flexible polyimide hinges, and then folded into a 3-D configuration, typically in a shape of cube or prism. Co-fabricated thru-wafer interconnects enable interfacing sensors on the device side of the TIMU with signal conditioning electronics potentially integrated inside a folded 3-D structure. We report a TIMU prototype with all 7 sensors operational, thus demonstrating a feasibility of the proposed fabrication approach. In this paper, we emphasize the characterization of the low-noise accelerometers, implemented on the TIMU sidewalls, demonstrating VRW of 0.057 m/s 2 / √ h and bias instability of <0.2 mg.

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“…In order to achieve high performance of the MCVG, analysis of energy dissipation mechanisms of the Q value of the MCVG during vibration becomes an important issue [13][14][15][16]. For the single-mode mass-damping-stiffness resonator, the value has been widely regarded as a combination of five energy dissipation mechanisms and inverse proportion to the total energy dissipation [17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Energy Dissipation Contribution Modeling of Vibratory Behavior for Silicon Micromachined Gyroscope

Zhou

Shen

Xie

et al. 2018

Shock and Vibration

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Energy dissipation contribution of micro-machined Coriolis vibratory gyroscope (MCVG) is modeled, numerically simulated, and experimentally verified in this paper. First, the amount of independent damping dissipation consisting of thermoelastic loss, anchor loss, surface loss, Akhiezer loss, and air damping loss during vibration is obtained by simulation model, PML-based method, and numerical calculation, respectively. Then, temperature and pressure dependence characteristic of the corresponding quality factor (Q) for the MCVG are obtained. Meanwhile, dominant sources of damping dissipation are determined, which paves the way to improve Q. Finally, the temperature-dependent and pressure-dependent characteristics of the total Q are measured with errors of less than 10% and 18% compared with the simulated total Q, respectively, in which accuracy is acceptable for predicting the damping dissipation behavior of MCVG in design stage before high-cost fabrication.

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100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

Cited by 64 publications

References 6 publications

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability

Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration

Energy Dissipation Contribution Modeling of Vibratory Behavior for Silicon Micromachined Gyroscope

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100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process

Cited by 64 publications

References 6 publications

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating &lt; 20 PPM scale factor stability

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating &lt; 20 PPM scale factor stability

Origami-like folded mems for realization of TIMU: fabrication technology and initial demonstration

Energy Dissipation Contribution Modeling of Vibratory Behavior for Silicon Micromachined Gyroscope

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Product

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Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability

Parametric drive of a toroidal MEMS rate integrating gyroscope demonstrating < 20 PPM scale factor stability