2018
DOI: 10.1155/2018/6901268
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Energy Dissipation Contribution Modeling of Vibratory Behavior for Silicon Micromachined Gyroscope

Abstract: Energy dissipation contribution of micro-machined Coriolis vibratory gyroscope (MCVG) is modeled, numerically simulated, and experimentally verified in this paper. First, the amount of independent damping dissipation consisting of thermoelastic loss, anchor loss, surface loss, Akhiezer loss, and air damping loss during vibration is obtained by simulation model, PML-based method, and numerical calculation, respectively. Then, temperature and pressure dependence characteristic of the corresponding quality factor… Show more

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Cited by 4 publications
(5 citation statements)
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References 66 publications
(76 reference statements)
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“…Secondly, it was obvious that the Coriolis quantity is multiplied by a proportional coefficient , which consequently reduces the scale factor of the actual angular rate output. Furthermore, the effect of the damping coupling can be neglectable compared with the quadrature error [ 29 ]. As a result, the phase delay online compensation can effectively reduce the coupling error in Coriolis output, which is necessary for improving the performance of the gyroscope.…”
Section: Phase Delay Analysis and Influencesmentioning
confidence: 99%
“…Secondly, it was obvious that the Coriolis quantity is multiplied by a proportional coefficient , which consequently reduces the scale factor of the actual angular rate output. Furthermore, the effect of the damping coupling can be neglectable compared with the quadrature error [ 29 ]. As a result, the phase delay online compensation can effectively reduce the coupling error in Coriolis output, which is necessary for improving the performance of the gyroscope.…”
Section: Phase Delay Analysis and Influencesmentioning
confidence: 99%
“…In this work, a completely symmetrical Z -axis gyroscope was selected as the controlling object, as shown in Figure 1 . The detailed operation principles of the gyroscope are omitted here, as they were described in our previous work [ 24 ].…”
Section: Analysis Of Oscillation Of Sense Modementioning
confidence: 99%
“…Currently, the high-vacuum packaging technology is an efficient method to improve the performance of the MCVG. It can suppress some bias sources by increasing the quality factor ( Q ) of the MCVG [ 21 , 22 , 23 , 24 ]. Nevertheless, the MCVG, as a typical two-order mass-damping-stiffness system, almost works in a critical damping state with increasing Q .…”
Section: Introductionmentioning
confidence: 99%
“…The CMP process is used to maintain the thickness and quality of the structures, and thus it maintains the surface quality for the next anodic bonding process (e.g., sandwich structures). CMP techniques permit obtaining the desired thickness and surface quality and to meet the application requirements for different MEMS devices [ 11 , 12 ]. However, the methods are limited by the high surface quality and the high total thickness variation, which should be addressed [ 13 ].…”
Section: Introductionmentioning
confidence: 99%