2011
DOI: 10.1590/s1517-70762011000200004
|View full text |Cite
|
Sign up to set email alerts
|

Influência da limpeza prévia por sputtering na nitretação por plasma de aços inoxidáveis

Abstract: RESUMOCorpos de prova de aço inoxidável ISO 5832-1 foram nitretados por 2 h em uma atmosfera de 50% vol. N 2 e 50% vol. H 2 , a uma temperatura de 420 ºC. Antes da nitretação as amostras passaram por um processo de limpeza por sputtering, no próprio reator, com utilização de diferentes parâmetros. Utilizaram-se as seguintes técnicas de análise: microscopia ótica (MO) e microdureza Vickers. Os resultados evidenciaram que o emprego de uma etapa de limpeza por sputtering, anterior ao processamento, pode promover … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0
1

Year Published

2013
2013
2022
2022

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(3 citation statements)
references
References 6 publications
0
2
0
1
Order By: Relevance
“…and C 2 H x /C 3 H x peaks since molecule configuration, with the intensity increasing as a function of the increase in applied potency. NOMINÉ [7] also showed the disruption of the non-aromatic L-proline ring, with no branching of the carbon chains after analyzing the residual products of degradation in a post-discharge microwave plasma.,…”
Section: Resultsmentioning
confidence: 97%
See 1 more Smart Citation
“…and C 2 H x /C 3 H x peaks since molecule configuration, with the intensity increasing as a function of the increase in applied potency. NOMINÉ [7] also showed the disruption of the non-aromatic L-proline ring, with no branching of the carbon chains after analyzing the residual products of degradation in a post-discharge microwave plasma.,…”
Section: Resultsmentioning
confidence: 97%
“…As an alternative technique, there is the plasma cleaning technology, which has been the object of study of several works [2][3][4][5][6][7] and shown to be an efficient technique in degradation of compounds with different organic functions. Plasma cleaning technologies are already being used in the cleaning of inputs in the semiconductor sectors [8], food industry [9], medical [10,11], sputtering printed circuit boards [12], surface modification [13][14][15][16] and nitriding [17,18].…”
mentioning
confidence: 99%
“…Este fato esta relacionado à ineficiência do hidrogênio como agente de sputtering, conforme já discutido em trabalho anterior [27]. Considerou-se, então, que a variação entre a etapa de limpeza por ultrassom e a condição pós-processamento está associada à absorção de nitrogênio durante a nitretação.…”
Section: Ganho Percentual De Massaunclassified