Nucleation and growth microstructural study of ti films on 304 SS substrates

Abstract

Coating of steel surfaces with titanium films has been studied with the objective to protect them against corrosion, and to create an intermediate film for CVD diamond and TiN film deposition. In this work, the nucleation, growth mechanisms and microstructural formation of the titanium films deposited on 304 stainless steel (304 SS) substrate are presented and discussed. The titanium films of variable thickness were obtained by vapour phase deposition produced by electron beam. The surfaces of these samples were observed by scanning electron microscopy. The cross sections of these samples were observed by using an atomic force microscope. The Ti film-304 SS interfaces were analyzed by X-ray diffraction. The results showed that titanium films have a columnar growth. The Ti film-304 SS interface had a residual compression stress at room temperature due to the interdiffusion process.

Depositing a Titanium Coating on the Lithium Neutron Production Target by Magnetron Sputtering Technology

“…But the grain size of (5) was larger than that of (6). This difference was also caused by the different surface roughness of their substrates that effected the nucleation and microstructural growth of Ti coating [ 36 , 37 ]. Nonetheless, the surface morphology of sample (5) was obviously different from sample (1) but similar to sample (6).…”

Structural characteristics of titanium coating on copper substrates

“…Its superior properties have led researchers to harness its applicability as coating on a variety of substrates, such as stainless steel (Musil et al 1996;Vieira and Nono 2004), copper Itzhak 1982, 1983;Bateni et al 2002), magnesium (Zhang et al 2005), silicon (Jung et al 2003;Jin et al 2009;Lee et al 2009;Oya and Kusano 2009;Zhang et al 2009) and glass (Jin et al 2009;Oya and Kusano 2009) essentially for corrosion protection of the underlying substrates or taking advantage of the biocompatibility of Ti with human tissues. The Ti coating has been synthesized by a variety of very high frequency plasma enhanced chemical vapour deposition Itzhak 1982, 1983), physical vapour deposition including magnetron sputtering (Musil et al 1996;Jung et al 2003;Vieira and Nono 2004;Zhang et al 2005Zhang et al , 2009Jin et al 2009;Oya and Kusano 2009) and pack cementation (Bateni et al 2002) techniques. Ti coatings on silicon substrates are being developed for fabrication of nuclear micro-batteries in which the beta particles emitted by tritium are used to produce electron-hole pairs in silicon, similar to solar cells (Lee et al 2009).…”

“…copper has a high coefficient of linear expansion which is equal to 16·6 × 10 −6 /K, whereas that of titanium is 8·6 × 10 −6 /K. Besides, Ti-Cu systems form various intermetallic compounds which have excellent wear resistance at temperatures as low as room temperature (Bateni et al 2002;SGTE 2004;Vieira and Nono 2004). Therefore, it is clear that, whatever the application, a study of the interface in detail is very important, as the presence of intermetallic compounds or voids can affect the adhesion and other physical properties of the coatings.…”