2020
DOI: 10.1109/tpel.2019.2952633
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10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field

Abstract: The advancement of silicon carbide (SiC) power devices with voltage ratings exceeding 10 kV is expected to revolutionize medium-and high-voltage systems. However, present power module packages are limiting the performance of these unique switches. The objective of this research is to push the boundaries of high-density, high-speed, 10 kV power module packaging. The proposed package addresses the well-known electromagnetic and thermal challenges, as well as the more recent and prominent electrostatic and electr… Show more

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Cited by 92 publications
(32 citation statements)
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“…6(a) shows common-mode interference on the output side of the three-phase inverter with an amplitude of approximately 16.67V. Accompanied by high-frequency interference, it conforms to the common mode calculation formula (6). In Fig.…”
Section: Experimental Verificationmentioning
confidence: 63%
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“…6(a) shows common-mode interference on the output side of the three-phase inverter with an amplitude of approximately 16.67V. Accompanied by high-frequency interference, it conforms to the common mode calculation formula (6). In Fig.…”
Section: Experimental Verificationmentioning
confidence: 63%
“…According to the definition and Eqn. ( 5), uNO is the common-mode voltage, and can be showed in (6) :…”
Section: B Anaysis Of Commmon Mode Interference In the Three Phase In...mentioning
confidence: 99%
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“…To reduce the EMI generated by this high-speed switching, a CM current screen that is fully integrated into the power module is proposed in this work. The proposed screen can reduce the ground current by 10 times [77]. This screening layer simultaneously increases the PDIV of the power module by 53 % [77].…”
Section: Introductionmentioning
confidence: 97%
“…The proposed screen can reduce the ground current by 10 times [77]. This screening layer simultaneously increases the PDIV of the power module by 53 % [77]. To maintain low electric field strength in the air surrounding the power module, while also minimizing size and inductance, a unique housing and bus bar interfacing scheme is proposed.…”
Section: Introductionmentioning
confidence: 99%