MTT-S International Microwave Symposium Digest
DOI: 10.1109/mwsym.1980.1124158
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10 GHz-10 W Internally Matched Flip-Chip GaAs Power FETS

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Cited by 2 publications
(2 citation statements)
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“…The internal matching circuits, in order to reduce to the package size, are designed based on an empirical configuration (Okamoto et al, 2005;Mitsui et al, 1980). The output matching circuit consists of a T-type pre-matching network with two series inductances and a shunt capacitance.…”
Section: Circuit Designmentioning
confidence: 99%
See 1 more Smart Citation
“…The internal matching circuits, in order to reduce to the package size, are designed based on an empirical configuration (Okamoto et al, 2005;Mitsui et al, 1980). The output matching circuit consists of a T-type pre-matching network with two series inductances and a shunt capacitance.…”
Section: Circuit Designmentioning
confidence: 99%
“…To solve such matching limitations and exhibit the basic device capabilities, the so-called internal matching networks (IMN) close to active device on the carrier or package is a good method. In the design of this kind of solid state power amplifiers packaged in a small size, however, the conventional impedance matching networks (Okamoto et al, 2005;Mitsui et al, 1980) have chosen to be designed at the centre frequency of the design band. This design method provides a serious problem when applied to the design of wideband high power amplifiers.…”
Section: Introductionmentioning
confidence: 99%