10.4: A Delamination Method and Ultra‐High‐Reliable Gas Barrier Film for Flexible OLED Displays

Abstract

A highly reliable ultra-high gas barrier (UGB) was developed and applied on the fabrication of 4.3-inch flexible AMOLED. The water vapor transmission rate of the UGB on flexible substrate could achieve ~ 10 -6 g/m 2 -day under a calcium test (60 C and 90%RH). In addition, a delamination method to remove the flexible AMOLED from the glass carrier was proposed where the mechanical strain during the delamination is controlled within 0.2%. With the incorporation of a metallic interlayer, the damage of TFT due to the electrostatic discharges from the delaminated surfaces can be prevented.

9.2: A Novel Lamination Process for Flexible AMOLED Encapsulation

“…It requires the water vapor transmission rate (WVTR) should be less than 5×10 -6 g . m -2 /d [4]. Figure 3-a showed the WVTR of UTBF tested by Mocon.…”

“…OLED is sensitive to the environment so that encapsulation for OLED required high gas barrier properties. Metal and glass are possessed high barrier properties and are often taken as encapsulation covers [4] .…”

82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method

“…Mechanical debond method along with debonding layer (DBL) technology have been proved to provide a high yield and thus lower cost manufacturing flow. [1][2][3] The temporary bonding technology can be divided into two parts, intrinsic strong bonding and intrinsic weak bonding. For strong bonding, heating treatment, such as LLO or oven baking, is applied to make the interface into weak bond or even direct separation.…”

P-97: Advantages of Coat-Debond Technology for Flexible Display

“…Besides, bonding force between PI substrate and carrier glass varies with PI material and array process. On the contrary, coat-debond technology can solve the mentioned issues by making debonding layer (DBL) to obtain native weak bond between PI and glass, and finally debonding mechanically [1][2]. Since the bonding is naturally very low irrespective of PI materials, there won't be sticking point problem, and the yield can be high.…”

“…Since the bonding is naturally very low irrespective of PI materials, there won't be sticking point problem, and the yield can be high. Except making strong bond into weak bond, DBL can provide additional functions such as electromagnetic insulation [2], static-charge elimination [2], and thermal dissipation [3] without extra cost.…”