2018
DOI: 10.1002/sdtp.12121
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82‐2: Substrate‐Free Flexible Electronics Manufacturing by Weak Bonding Method

Abstract: By using weak bonding method, a flexible electronics either of organic or inorganic substrate formed on a rigid carrier glass can be directly separated from the carrier glass, with protection film-assisted, by mechanical de-bonding method. Without PI substrate, multi-advantages are demonstrated for flexible OLED display production.

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Cited by 4 publications
(2 citation statements)
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“…The paper also demonstrates the advantages of not using a PI substrate in flexible OLED display production. [33] María Rodríguez Fernández Et Al. 's work aimed to help us understand primary display production technology especially those with minimal power consumption.…”
Section: Literature Surveymentioning
confidence: 99%
“…The paper also demonstrates the advantages of not using a PI substrate in flexible OLED display production. [33] María Rodríguez Fernández Et Al. 's work aimed to help us understand primary display production technology especially those with minimal power consumption.…”
Section: Literature Surveymentioning
confidence: 99%
“…Laser irradiates the lower PI surface through the glass substrate to weaken the adhesion between PI Film and Glass. It is well known that the current laser lift of (LLO) process of the flexible OLED display consists of expensive optical equipment and costexhausting maintenance, and the glass substrate surface smoothness [1][2][3]. Mechanical separation has been known as one of the best candidates to replace LLO.…”
mentioning
confidence: 99%