2021
DOI: 10.1063/5.0068306
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1 GeV proton damage in β-Ga2O3

Abstract: The changes of electrical properties and deep trap spectra induced in n-type β-Ga2O3 by 1 GeV protons with a fluence of 4 × 1013 cm−2 were studied. The carrier removal rates were ∼100 cm−1 at this energy. For comparison, for 20 MeV proton irradiation at comparable fluences (5–10 × 1014 cm−2), the removal rate was ∼400 cm−1 for donor concentrations of 3 × 1016 cm−3 and ∼100 cm−1 for concentrations of <1016 cm−3. These removal rates were in stark contrast with modeling results that predicted the introduct… Show more

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Cited by 12 publications
(10 citation statements)
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“…Admittance spectra (AS) [31] at frequencies from 20 Hz to 2 MHz in the temperature range 100 K-450 K, and by deep level transient spectroscopy (DLTS) [20,31]. Details of the experimental setups can be found elsewhere [18,20,24,25,[32][33][34][35][36][37].…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Admittance spectra (AS) [31] at frequencies from 20 Hz to 2 MHz in the temperature range 100 K-450 K, and by deep level transient spectroscopy (DLTS) [20,31]. Details of the experimental setups can be found elsewhere [18,20,24,25,[32][33][34][35][36][37].…”
Section: Methodsmentioning
confidence: 99%
“…Proton irradiations were carried out at room temperature with energies 1.1 MeV, flux of 10 11 -10 12 cm −2 s −1 and fluences 10 13 , 10 14 , 10 15 or 10 16 cm −2 . The linear accelerator I-2 serving as a proton injector of a cyclotron with proton energy up to 10 GeV was used [32,[35][36][37]. The proton energy inside the accelerator was 24.6 MeV, the proton beam exited through a port into air, with the energy reduced to 22.5 MeV and further attenuated to the required energy using a set of calibrated metal foils (degraders) reducing the energy to 1.1 MeV.…”
Section: Methodsmentioning
confidence: 99%
“…Total Dose Damage Since Ga2O3 devices and more generally all wide bandgap semiconductor devices normally use metal gates, Total Ionizing Dose (TID) effects are not as important as they are in Si technology (42,(68)(69)(70)(71)(72) , which is based on MOS-gate devices. The relations between charge (e) and electric field, E (Poisson's equation) and the transport (drift/diffusion) equations depend on carrier mobility (µe,p ) and density (n,p), i.e., 𝐽𝐽 𝑛𝑛 = 𝑒𝑒µ 𝑛𝑛 𝑛𝑛𝑛𝑛 − 𝑛𝑛𝐷𝐷 𝑛𝑛 𝛻𝛻𝑛𝑛 𝐽𝐽 𝑝𝑝 = 𝑒𝑒µ 𝑝𝑝 𝑝𝑝𝑛𝑛 − 𝑛𝑛𝐷𝐷 𝑝𝑝 𝛻𝛻𝑝𝑝…”
Section: (I)mentioning
confidence: 99%
“…Radiation tolerance is an important factor while fabricating microelectronics and typical radiation damage suffered includes total dose effects, displacement damage, and single event effects . While significant work has been done for radiation effects in GaN (1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)61) and SiC (45)(46)(47)(48)(49)(50)(51)(52)(53)(54)(55)(56)(57)(58)(59)(60)(62)(63)(64)(65)(66)(67) , the understanding of carrier removal rates, defect levels and annealing regimes for Ga2O3 is on-going (68)(69)(70)(71)(72)(73)(74) .…”
Section: Introductionmentioning
confidence: 99%
“…9,23,24 Of course, for open space applications, much higher energies of particles and a much higher range of particles of interest is of interest. Such studies are being carried out for different semiconductors, the radiation tolerance of b-Ga 2 O 3 devices to protons in the 100 MeV-1 GeV range, 25,26 and to irradiation with high energy heavy ions have been published [27][28][29] and also demonstrate a high radiation tolerance of b-Ga 2 O 3 devices. Thus, comparing the radiation tolerance of g/b-Ga 2 O 3 test devices to that of b-Ga 2 O 3 devices looks as a justified measure of the radiation-tolerance worthiness of the g/b-Ga 2 O 3 samples in electronic sense.…”
Section: Introductionmentioning
confidence: 99%