1994
DOI: 10.1109/16.333811
|View full text |Cite
|
Sign up to set email alerts
|

1/f noise and radiation effects in MOS devices

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

6
97
1

Year Published

2002
2002
2021
2021

Publication Types

Select...
5
2
2

Relationship

1
8

Authors

Journals

citations
Cited by 174 publications
(104 citation statements)
references
References 104 publications
6
97
1
Order By: Relevance
“…The flicker 1/f noise in semiconductors and metals is usually associated with structural defects. Therefore, introduction of defects by electron, ion, gamma or X-ray irradiation normally results in increased levels of 1/f noise [2,[18][19][20]. However, as an exception to the rule, there have been a few reports when the 1/f noise decreased as a result of irradiation [24][25].…”
mentioning
confidence: 99%
See 1 more Smart Citation
“…The flicker 1/f noise in semiconductors and metals is usually associated with structural defects. Therefore, introduction of defects by electron, ion, gamma or X-ray irradiation normally results in increased levels of 1/f noise [2,[18][19][20]. However, as an exception to the rule, there have been a few reports when the 1/f noise decreased as a result of irradiation [24][25].…”
mentioning
confidence: 99%
“…The latter provided a strong motivation for the present study. The irradiation experiments were crucial for gaining understanding 1/f noise in conventional materials and metal-oxide-semiconductor field-effect transistors [18][19][20]. Investigation of the effects produced by the electron beams on 1/f noise in graphene can elucidate the mechanisms of 1/f noise and answer a question of graphene's prospects for radiation-hard applications.…”
mentioning
confidence: 99%
“…It is also reported in the works of Fleetwood and Scofield (1990) and Fleetwood et al, (1994) that TID effects increase the 1/f noise in MOS devices, as shown in Fig. 1.…”
Section: Introductionmentioning
confidence: 79%
“…However, in the case of strained-Si on Si 1−x Ge x , Ge diffusion to the Si/ HfO 2 interface may result in an increase in the interface state and fixed-charge densities for these devices [6]. Furthermore, the presence of border traps [7], which can exchange charge with Si on a time-scale ∼1 s, can increase 1/f noise as reported in the study in [8]. The evaluation of border traps and interface traps is, thus, a critical reliability concern in the case of high-κ/Si or high-κ/strained-Si MOSFET devices.…”
Section: Introductionmentioning
confidence: 79%