“…In these cases, it is not practical to produce thick PZT films using standard sol-gel techniques, because of the increased cracking risk due to shrinkage nor is it desirable to produce thick films by a repetitive single layer deposition process due to the time required (Barrow et al, 1995;Zhou et al, 2000). The interest in ferroelectric lead zirconate titanate thick films for device applications, including high-frequency ferroelectric sonar transducers (Bernstein et al, 1997), microelectromechanical system devices (Polla & Schiller, 1995;Myers et al, 2003;(Akasheh et al, 2004), elastic surface wave devices (Cicco et al, 1996), hydrophones (Chan et al, 1999) and sensors (Xia et al, 2001), has increased in the last decades because PZT ferroelectric thick films possess the merits of both bulk and thin film materials (Barrow et al, 1997;Ledermann et al, 2003). PZT thick films devices not only work at low voltage and high frequency, as they are compatible with semiconductor integrated circuit, but also possess superior electric properties approaching near-bulk values.…”