1999
DOI: 10.1117/12.354357
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0.7-NA DUV step-and-scan system for 150-nm imaging with improved overlay

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Cited by 6 publications
(4 citation statements)
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“…All experiments are performed on PAS 5500/700 and PAS 5500/750E Step & Scan system with a maximum NA of 0.70 and an AERIAL II TM illuminator [5]. As photo resist Shinetsu SEPR 463 was used according to the conditions given in table 2.…”
Section: Methodsmentioning
confidence: 99%
“…All experiments are performed on PAS 5500/700 and PAS 5500/750E Step & Scan system with a maximum NA of 0.70 and an AERIAL II TM illuminator [5]. As photo resist Shinetsu SEPR 463 was used according to the conditions given in table 2.…”
Section: Methodsmentioning
confidence: 99%
“…In current step and scan systems the wafer coordinates in the wafer plane are determined prior to exposure, using fiducial markers on the wafer stage as a reference 5 . These fiducial markers are then aligned to the reticle and during the actual exposure the positional information is used to 'blindly' step to the required position without further measurements on the wafer.…”
Section: Measurement Position Expose Positionmentioning
confidence: 99%
“…At the measurement position, the position of the wafer relative to two reference markers on the wafer stage is determined by means of the ATHENA™ alignment system with two colors and seven diffraction orders 5 . The reference markers on the wafer stage are located on two TIS plates (TIS plate 1 and TIS plate 2, see Figure 6) that are located on diagonal positions on the wafer stage.…”
Section: Wafer Alignmentmentioning
confidence: 99%
“…Compared with other methods, machine vision based alignment has many advantages, such as high precision, process intuitive, simple structure, and high efficiency [1][2][3][4][5][6] . Therefore, it has been widely used in many applications including in optical lithography tools.…”
Section: Introductionmentioning
confidence: 99%