2004
DOI: 10.1049/el:20040049
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0.6 W CW GaInNAs vertical external-cavity surface emitting laser operating at 1.32 [micro sign]m

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Cited by 127 publications
(43 citation statements)
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“…The simulated structure has been designed on the basis of the multi-quantum well GaInNAs/GaAs laser emitting at 1.32 µm and described in the paper [6]. It is placed on the GaAs substrate -its thickness has been assumed to be equal to 450 µm.…”
Section: Laser Structuresmentioning
confidence: 99%
See 1 more Smart Citation
“…The simulated structure has been designed on the basis of the multi-quantum well GaInNAs/GaAs laser emitting at 1.32 µm and described in the paper [6]. It is placed on the GaAs substrate -its thickness has been assumed to be equal to 450 µm.…”
Section: Laser Structuresmentioning
confidence: 99%
“…Spectral and temperature dependences of the parameters can be found in references given in the table. The model has been calibrated using experimental results for the structure in the UHS configuration from [6]. The monomolecular recombination coefficient, internal losses and scattering coefficients of air-cap, air-heat spreader and heat spreader-cap interfaces have been used as fitting parameters.…”
Section: Carrier Transport Modulementioning
confidence: 99%
“…All VECSEL concepts, including a resonant sub-cavity which enhances the effective gain, suffer from a relatively high sensitivity to operating temperature changes [Kuz99,Tro04]. Such conventional QW-based T=8°C T=10°C T=15°C T=20°C T=25°C T=30°C T=35°C 21x SK-QD GS λ = 1210 nm VECSELs operating close to the target wavelength of 1220 nm face additional difficulties upon growth due to the employed highly strained QWs, and exhibit strong temperaturedependent characteristics limiting optimum laser performance to a narrow temperature window [Ger03,Hop04]. This sensitivity is caused by the diverging thermal shifts of the involved components.…”
Section: Temperature Stabilitymentioning
confidence: 99%
“…A piece of the wafer is then soldered to the heatsink and the semiconductor substrate removed by a combination of mechanical/chemical etching. The second approach to SDL thermal management introduced by Sandia National Laboratories [49] and subsequently refined by the University of Strathclyde and collaborators [50,51] uses an unprocessed epilayer, grown mirror first, onto which a high conductivity platelet, referred to as a heatspreader, is bonded directly using liquid capillarity [52]. This composite is then clamped in a heatsinking mount using indium foil (although solder could also be used).…”
Section: Thermal Managementmentioning
confidence: 99%