Micro chemically Ni − P plated diamond tools were developed and the crysta1 structure of plating layer was made clean Ddlling齟 grooving ch 踟 α eri 部ics ofsingle 呵 s囲 line silicon d q tz g1 閃 s wcre ex ined usi these tools rcgarding mach ing mode , tool life , ho1 ¢ diameter change , product quality , etc . As a rcsul ち the tool life in gTooving glass was almost a 皿 halfof that in silicon , which may result from the thermal conductivity . in helica1 drillilg of silicon more than 800 holes could be machined at the maximum . Key MordS: Chemical plat 正 n & Diamond tool, Single c 匸 yst 副 ine s 正 licon , Quartz glas 亀 Grooving characteristics , Ddllhlg charac slics , Ultrasonic yibration cuhing
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