The enhancement of strength of a Cu 1.4 massNi 0.25 massP 0.1 massZr alloy, in which the Ni and P contents are about twice larger than those in commercial Cu Ni P alloys, has been tried by means of combining accumulative roll bonding (ARB) process by 7 cycles and aging treatment at 350 to 450°C. For the sake of comparison, the mechanical properties of the alloy conventionally cold rolled to a reduction of 50 and 90 and aged at 350 to 450°C have also been examined. The grain sizes of the Cu Ni P Zr specimens deformed by 7 cycle ARB process and 90 cold rolling were refined down to about 0.4 mm and 4 mm, respectively, and the fractions of high angle grain boundaries in the specimens were nearly the same, about 45. Initial aging, subsequent ARB process or 90 cold rolling and re aging at 400°C produced the Cu Ni P Zr alloy highly strengthened. The alloy, initially aged, then ARB processed and re aged, had a tensile strength of 780 MPa, an elongation of 6 up to failure and an electrical conductivity of 56 IACS. The differences in yield strength among the re aged specimens after 50 and 90 cold rolling and ARB process are explained by the differences among the dislocation density, grain size and inter precipitate spacing. (Received December 20, 2010; Accepted June 3, 2011) Keywords: copper nickel phosphorus alloy, accumulative roll bonding process, tensile property, grain refinement strengthening, precipitation strengthening, dislocation strengthening
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.