The fabrication process of porous copper (Cu) current collectors having the pore diameter (3-50 µm) and the rate of opening area (1-4%) was developed with a system constructed with a pico-second pulse laser and a polygon mirror. The fabricated porous Cu current collectors were used to evaluate the porous design on the Cu current collector for exhibiting higher Li + doping reaction rate with cells in which graphite electrodes were laminated with separators and the laminated graphite anode opposites to Li metal through a separator. It was found in this study that the conditions of hole diameter (5 µm) and the rate of opening area (1%) is the best one to realize high Li + doping rate and that the rate determining step of the pre-doping reaction is the diffusion of Li + ion in the pore of the Cu porous current collectors.
Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films decreased concomitantly with increasing Ni-P layer ratio in the Ni-P/Cu bilayer.
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