Purpose
This paper aims to discuss the effect of surface treatment on the wettability between copper and a lead-free solder paste. The industrial applications of laser technologies are increasing constantly. A specific laser treatment can modify the surface energy of copper and affect the wetting properties.
Design/methodology/approach
The surfaces of copper plates were treated using an Nd:YAG laser with varying laser powers. After laser surface treatment, wetting experiments were performed between the copper plates and SAC305 lead-free solder paste. The effect of laser treatment on copper surface was analysed using optical microscopy and scanning electron microscopy (SEM).
Findings
The experimental results showed that the wetting contact angles changed with the variation in laser power. Furthermore, it means that the surface energy of copper plates was changed by the laser treatment. The results demonstrated that the contact angles also changed when a different soldering paste was used.
Originality/value
Previous laser surface treatment can be a possible way to optimize the wettability between solders and substrates and to increase the quality of the soldered joints.
The development of bonding technology and coating technologies require the use of modern materials and topologies for the demanding effect and modification of their wetting properties. For the industry, a process modification process that can be integrated into a process is the atmospheric pressure of air operation plasma surface treatment. This can be classified and evaluated based on the wettability, which has a significant impact on the adhesive force. The aim is to improve the wetting properties and to find the relationship between plasma treatment parameters, wetting, and adhesion. High Impact PolyStyrene (HIPS) was used as an experimental material, and then the plasma treatment can be treated with various adjustable parameters. The effect of plasma parameters on surface roughness, wetting contact angle, and using Fowkes theory of the surface energy have been investigated. Seven different plasma jet treatment distances were tested, combined with 5 scan speeds. Samples with the best plasma parameters were prepared from 25 mm × 25 mm overlapping adhesive joints using acrylic/cyanoacrylate. The possibility of creating a completely hydrophilic surface was achieved, where the untreated wetting edge angle decreased from 88.2° to 0° for distilled water and from 62.7° to 0° in the case of ethylene glycol. The bonding strength of High Impact PolyStyrene was increased by plasma treatment by 297%.
Polylactic acid (PLA) is one of the most promising biopolymers often used as a raw material in 3D printing in many industrial areas. It has good mechanical properties, is characterized by high strength and stiffness, but unfortunately, it has some disadvantages; one is brittleness, and the other is slow crystallization. Amounts of 1–5% SEBS (styrene-ethylene-butylene-styrene) thermoplastic elastomer were blended into the PLA and the thermal and mechanical properties were investigated. DSC (Differential Scanning Calorimetry) measurements on the filaments have shown that SEBS increases the initial temperature of crystallization, thereby acting as a nucleating agent. The cooling rate of 3D printing, on the other hand, is too fast for PLA, so printed specimens behave almost amorphously. The presence of SEBS increases the impact strength, neck formation appears during the tensile test, and in the bending test, the mixture either suffers partial fracture or only bends without fracture. Samples containing 1% SEBS were selected for further analysis, mixed with 0.06 and 0.1% carbon nanotubes (CNTs), and tested for thermal and mechanical properties. As a result of CNTs, another peak appeared on the DSC curve in addition to the original single-peak crystallization, and the specimens previously completely broken in the mechanical tests suffered partial fractures, and the partially fractured pieces almost completely regained their original shape at the end of the test.
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