P–O–H polycondensation
−O–Cu–O–
ion-bonded bridges were formed in copper phosphate thermal insulation
materials by mixing Al(OH)3 dissolved in H3PO4 with CuO filler and Al2O3, SiC, ZrC,
and Cr2O3 as curing accelerators, alone or in
combination. The effects of different additive combinations on the
curing behavior and thermal stability of the copper phosphate thermal
insulation material matrixes were compared using thermogravimetry/differential
scanning calorimetry, X-ray diffractometry, and scanning electron
microscopy. The copper phosphate materials exhibit good thermal stabilities
and low thermal conductivities. The thermal weight losses before and
after ceramic reinforcement were 4–19.8 and 3.8–9.4%,
respectively, and the thermal conductivities of the P–O–H
polycondensation −O–Cu–O– ion-bonded bridges
formed in the copper phosphate thermal insulation materials were in
the range of 0.656–1.824 W/(m·K).
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