Here we demonstrate a simple and effective method of fabricating polymeric scattering substrate for flexible organic light-emitting diodes (OLEDs) that require no costly patterning, etching, or molding processes, aspects that are desirable for the commercialization of large-scale lighting panels. Systematic study of the influences of relative index of refraction, particle size, and doping concentration on transmittance and haze of transparent colorless polyimide (cPI) films was carried out. It was found that the reduction of transmittance and haze of the doped films decreases along with the decrease of the difference of refractive index between the particles and polymer matrix, and it could be compensated by the increase of particle size or doping concentration.
Thin‐film encapsulation (TFE) for foldable AMOLED display is necessary to have good reliability and excellent bendability. TFE mask induces particles easily and crack occurs in thick TFE layer during panel bending. We developed TFE with Al2O3 layer for high water‐proof and very thin thickness, satisfying the requirement of reliability and bendability. The Al2O3 layer in TFE structure was deposited by low temperature atomic layer deposition (ALD) method, and we realized TFE mask‐less process through adapting dry‐etch parameters for Al2O3 etch, finding that BCl3 has very excellent dry‐etch selectivity between inorganic layer (SiOx/SiNx/SiOxNy) and Al2O3. Besides, we also attempted to make the organic layer of TFE acted as etch mask, and it proved to be feasible, indicating that all the TFE masks could be taken out effectively. Moreover, we proved good optic and reliability characteristics of AMOLED display with mask‐less TFE structure.
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