As a representative intrinsic p-type inorganic semiconductor material, cuprous oxide (Cu 2 O) has been widely used in photovoltaics, catalysis, chemical industries, and other fields, owning an extremely important position. For a long time, the literature on the preparation methods and preparation technologies of Cu 2 O have been relatively scattered and independent, resulting in a certain degree of obstacles and difficulty in obtaining relevant technical knowledge and understanding the internal principles. Aiming at the progress and innovation of Cu 2 O preparation methods and technologies in recent years, combined with our team's long-term experience accumulation and research results, this article focuses on the classification, principles, and characteristics of the various Cu 2 O preparation methods and also involves representative applications and performance in the light energy utilization area. This review aims to provide reference and guidance for the preparation and research of Cu 2 O and other related inorganic oxide semiconductors.
The mid-plane model for warpage simulation of injection-molded parts requires a mid-plane mesh whose transformation is considerably time consuming. To overcome this drawback, a surface model-based warpage simulation is presented, in which the part is represented as a perfect bonding of two half-thickness plates with their reference surfaces at the outer boundary of the part. The plates over the surface mesh are modeled as flat shell elements, and a new triangular flat shell element is developed which combines an Assumed Natural DEviatoric Strain (ANDES) based membrane component and a Refined Nonconforming Element Method (RNEM) based bending component. The bonding is accomplished by multipoint constraints and a Lagrange multiplier based elimination method is proposed for constraint application. The results show that compared with some popular shell elements, ANSYS, Moldflow and the experiments, the presented model exhibits a high performance in computation accuracy. POLYM. ENG. SCI., 51:785-794, 2011. ª 2011
Society of Plastics Engineers
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