No abstract

No abstract

Chemical-looping combustion is an indirect combustion technology with inherent separation of the greenhouse gas CO2. The feasibility of using NiO as an oxygen carrier during chemical-looping combustion of coal has been investigated experimentally at 800−960 °C in the present work. The experiments were carried out in a fluidized bed, where the steam acted as the gasification−fluidization medium. Coal gasification and the reaction of oxygen carrier with the water gas take place simultaneously in the reactor. The oxygen carrier particles exhibit high reactivity above 900 °C, and the dry basis concentration of CO2 in the exit gas of the reactor is nearly 95%. The flue gas composition as a function of the reactor temperature and cyclic reduction number is discussed. At 800−960 °C, the dry basis concentration of CO2 in the flue gas presents a monotonously increasing trend, whereas the dry basis concentration of CO, H2, and CH4 decreases monotonously. The concentrations of CO2, CO, H2, and CH4 in the flue gas as a function of cyclic reduction number present a para-curve characteristic at 900 °C. With the increase of cyclic reduction number, the dry basis concentration of CO2 decreases remarkably, while the dry basis concentrations of CO, H2, and CH4 increase rapidly. Moreover, the peak value of H2 concentration is less than that of CO. The performance of the NiO-based oxygen carriers was also evaluated using an X-ray diffractometer and a scanning electron microscope to characterize the solid residues of oxygen carrier. The results indicate that NiO is one of the suitable oxygen carriers for chemical-looping combustion of coal.

Firm immobilization of catalysts on the predesigned position over substrates is an essential process for producing flexible circuits by the electroless deposition (ELD) process. In this work, a compatible Ag + complex was developed and directly printed on the poly(ethylene terephtalate) (PET) film through a micro inkjet printing instrument to trigger the deposition of ultrafine copper patterns with approximately 20 μm in width. Morphological and elementary characterization verified that the nanosized silver catalyst was uniformly distributed in the bridge layer, which could enhance the adhesion between the PET film and deposited copper patterns. Moreover, after 30 min of ELD, the copper patterns exhibited a low resistivity of 2.68 × 10 −6 Ω•cm and maintained considerable conductivity even after 2000 times of cyclical bending. These interesting conductive and mechanical features demonstrate the tremendous potential of this Ag + complex-assisted copper deposition in the interconnection of high-density integrated flexible electronics.

No abstract