The uniformity of plating copper layer thickness and film clip rate is one of the important indicator of PCB’s quality, which will affect depply by electroplating. This papar think about it from the uniformity of electric field distribution, and try to make the PCB have copper coating uniformity higher than 90% and rang less than 12 m through optimization the process parameters of the core equipment in the process of copper - Tong Gang, thereby reducing the positive film clip rate, and improving the quality of PCB. The main process parameters needed to optimize in this article is the anode placement, anode length and so on
To solve the difficult and low-efficient processing problems of slender inner helical surface, the layered processing theory and method of slender inner helical surface based on slender inner helical surface structure in screw drill stator as the research object is put forward. The whole processing of slender inner helical surface is innovated by simple layer processing, which reduce the processing difficulty and improve manufacturing efficiency. The key techniques are studied such as screw drill stator structure, the design method and processing technology and the analysis and calculation of interference, which provide the theory for layered processing of slender inner helical surface structural components processing.
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