A new cycle model of a two-stage combined semiconductor thermoelectric device that is used as a heat pump is established. The influence of Joule heating due to the electric current and heat leak due to the temperature difference between the hot and the cold junctions on the performance of the system is investigated. The general expressions of three important performance parameters, the coefficient of performance (COP), the rate of heat pumping and the power input, are derived. The maximum COP and the corresponding parameters are calculated. The internal structure parameter

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