By developing a low-temperature (≤300 °C) fabrication process for the gate-stack structure on Ge(111), we study electrical properties of thin film transistors (TFTs) consisting of (111)-oriented pseudo-single-crystalline-germanium (PSC-Ge) channels on glass. Although the Hall mobility (μHall) of p-type PSC-Ge layers reaches 210 cm2/V s and the gate-stack/Ge interface has low trap density, we observe field-effect-mobility (μFE) fluctuation in the p-channel TFTs from 8.2 to 71 cm2/V s, depending on the thickness of the PSC-Ge layer. Considering the μFE fluctuation and low Ion/Ioff ratio in the p-TFTs, we infer the presence of defective Ge layers near the surface of the glass substrate. This study reveals that it is quite important for the high-performance p-Ge TFTs to improve the quality of the Ge layer near the surface of the glass substrate or to choose other materials with better Ge/substrate interface qualities.
We study the level spacing distribution p(s) in the spectrum of random networks. According to our numerical results, the shape of p(s) in the Erdős-Rényi (E-R) random graph is determined by the average degree k and p(s) undergoes a dramatic change when k is varied around the critical point of the percolation transition, k = 1. When k 1, the p(s) is described by the statistics of the Gaussian orthogonal ensemble (GOE), one of the major statistical ensembles in Random Matrix Theory, whereas at k = 1 it follows the Poisson level spacing distribution. Closely above the critical point, p(s) can be described in terms of an intermediate distribution between Poisson and the GOE, the Brodydistribution. Furthermore, below the critical point p(s) can be given with the help of the regularized Gamma-function. Motivated by these results, we analyse the behaviour of p(s) in real networks such as the internet, a word association network and a protein-protein interaction network as well. When the giant component of these networks is destroyed in a node deletion process simulating the networks subjected to intentional attack, their level spacing distribution undergoes a similar transition to that of the E-R graph.
We investigated the source/drain (S/D) parasitic resistance (R P ) of a Ge n-channel metal-oxidesemiconductor field-effect transistor (n-MOSFET) with TiN-S/D. The R P was as high as ∼1400 Ω, which is attributed to a very thin amorphous interlayer (a-IL) at a TiN/Ge interface. To solve this problem, n-MOSFETs with an embedded S/D structure were fabricated, of which the S/D was formed by the etching of a Ge layer using 0.03%-H 2 O 2 solution followed by TiN sputter deposition. The electrical performances were investigated for devices with etching depths in the range of 2-22 nm. The devices with etching depths of 2-5 nm did not work. The devices with etching depths of 12-15 nm showed a quite normal transistor operation, and the R P was as low as ∼130 Ω, which is comparable to that of a p-MOSFET with PtGe-S/D. However, R P s of the devices with etching depths of ∼22 nm was considerably high. The reason for these results is discussed on the basis of an a-IL formation at the sidewall of the engraved S/D region.
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