We experimentally demonstrate low-loss and polarization-insensitive fiber-to-chip coupling spot-size converters (SSCs) comprised of a three dimensionally tapered Si wire waveguide, a SiON secondary waveguide, and a SiO(2) spacer inserted between them. Fabricated SSCs with the SiO(2) spacer exhibit fiber-to-chip coupling loss of 1.5 dB/facet for both the quasi-TE and TM modes and a small wavelength dependence in the C- and L-band regions. The SiON secondary waveguide is present only around the SSC region, which significantly suppresses the influence of the well-known N-H absorption of plasma-deposited SiON at around 1510 nm.
We demonstrate a silicon Mach-Zehnder modulator (MZM) based on hydrogenated amorphous silicon (a-Si:H) strip-loaded waveguides on a silicon on insulator (SOI) platform, which can be fabricated by using a complementary metal-oxide semiconductor (CMOS) compatible process without half etching of the SOI layer. Constructing a vertical p-n junction in a flat etchless SOI layer provides superior controllability and uniformity of carrier profiles. Moreover, the waveguide structure based on a thin a-Si:H strip line can be fabricated easily and precisely. Thanks to a large overlap between the depletion region and optical field in the SOI layer with a vertical p-n junction, the MZM provides 0.80- to 1.86-Vcm modulation efficiency and a 12.1- to 16.9-dBV loss-efficiency product, besides guaranteeing a 3-dB bandwidth of about 17 GHz and 28-Gbps high-speed operation. The αVL is considerably lower than that of conventional high-speed modulators.
This paper presents optimized design and measurement results for a low-loss broadband vertical interlayer transition (VIT) device located between lower and upper Si nano-photonic waveguides. The device comprises the lower c-Si taper, the upper a-Si:H taper, and a wide and thin SiON secondary core with a 0.6-μm-thick SiO₂ interlayer. The device structure facilitates the low loss VIT, giving insertion losses of 0.87 and 0.79 dB for quasi-TE and TM modes, respectively, at 1550 nm. Also, the evanescent coupling nature of the VIT device renders it wavelength- and polarization-insensitive, leading to loss variation of within 0.5 dB in the C-band.
A simple low-loss fiber coupling structure consisting of a Si
inverted-taper waveguide and a 435 nm wide and 290 nm thick SiN
waveguide was fabricated with fully complementary metal-oxide
semiconductor (CMOS)-compatible processes. The small SiN waveguide can
expand to the optical field corresponding to a fiber with a mode-field
diameter of 4.1 µm. The fiber-to-chip coupling losses were 0.25 and
0.51 dB/facet for quasi-TE and quasi-TM modes, respectively, at a
1550 nm wavelength. Polarization-dependent losses of the conversion in
the Si-to-SiN waveguide transition and the fiber-to-chip coupling were
less than 0.3 and 0.5 dB, respectively, in the wavelength range of
1520–1580 nm.
For Si wire waveguides, we designed a highly efficient fiber coupling structure consisting of a Si inverted taper waveguide and a CMOS-compatible thin SiN waveguide with an SiO2 spacer inserted between them. By using a small SiN waveguide with a 310 nm-square core, the optical field can be expanded to correspond to a fiber with a 4.0-μm mode field diameter. A coupled waveguide system with the SiN waveguide and Si taper waveguide can provide low-loss and low-polarization-dependent mode conversion. Both losses in fiber-SiN waveguide coupling and SiN-Si waveguide mode conversion are no more than 1 dB in a wide wavelength bandwidth from 1.36 μm to 1.65 μm. Through a detailed analysis of the effective refractive indices in the coupled waveguide system, we can understand mode conversion accurately and also derive guidelines for reducing the polarization dependence and for shortening device length.
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