We study the high-temperature electroluminescence properties of 600 nm InGaN red 40 × 40 μm2 micro-light-emitting diodes (μLEDs) with a peak external quantum efficiency (EQE) of 3.2%. Temperature-dependent peak wavelength measurements show a low redshift of 0.05 nm/K. The injection efficiency improves with increasing temperature. The hot/cold (HC) factor is used to quantify the thermal droop: at 400 K, the EQE and wall-plug efficiency HC factors at 50 A/cm2 reach high values of 0.72 and 0.85, respectively. This demonstrates the robustness of InGaN red μLEDs up to high temperature, with a much-improved stability over conventional AlInGaP red μLEDs.

Red micro-size light-emitting diodes (μLEDs) less than 10 × 10 μm2 are crucial for augmented reality (AR) and virtual reality (VR) applications. However, they remain very challenging since the common AlInGaP red μLEDs with such small size suffer from a dramatic reduction in the external quantum efficiency. In this work, we demonstrate ultra-small 5 × 5 μm2 607 nm amber μLEDs using InGaN materials, which show an EQE over 2% and an ultra-low reverse current of 10−9 A at −5 V. This demonstration suggests promising results of ultra-small InGaN μLEDs for AR and VR displays.

We present efficient red InGaN 60 × 60 μm2 micro-light-emitting diodes ( μLEDs) with an epitaxial tunnel junction (TJ) contact. The TJ was grown by metal-organic chemical vapor deposition using selective area growth. The red TJ μLEDs show a uniform electroluminescence. At a low current density of 1 A/cm2, the emission peak wavelength is 623 nm with a full-width half maximum of 47 nm. The peak external quantum efficiency (EQE) measured in an integrating sphere is as high as 4.5%. These results suggest a significant progress in exploring high efficiency InGaN red μLEDs using TJ technology.

InGaN-based red micro-size light-emitting diodes (μLEDs) have become very attractive. Compared to common AlInGaP-based red µLEDs, the external quantum efficiency (EQE) of InGaN red µLEDs has less influence from the size effect. Moreover, the InGaN red µLEDs exhibit a much more robust device performance even operating at a high temperature of up to 400 K. We review the progress of InGaN red μLEDs. Novel growth methods to relax the strain and increase the growth temperature of InGaN red quantum wells are discussed.

We demonstrate high performance 10×10 µm2 InGaN amber micro-size light-emitting diodes (µLEDs). At 15 A/cm2, the InGaN µLEDs show a single emission peak located at 601 nm. The peak external quantum efficiency (EQE) and wall-plug efficiency is 5.5% and 3.2%, respectively. Compared to the 100×100 µm2 µLEDs, the 10×10 µm2 InGaN red µLEDs maintain a similar EQE value with a same efficiency droop. These results point out that InGaN materials are much more promising for a higher efficiency than the common AlInGaP materials for the ultra-small size red µLEDs required by augmented reality and virtual reality displays.