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Forming free resistive switching in graphene oxide thin film for thermally stable nonvolatile memory applications Resistive switching properties of plasma enhanced-ALD La2O3 for novel nonvolatile memory application J. Vac. Sci. Technol. A 30, 01A148 (2012); 10.1116/1.3669516Robust unipolar resistive switching of Co nano-dots embedded ZrO2 thin film memories and their switching mechanism

Resistance switching in nanogap electrodes, the electrodes of which are made of platinum and gold, was investigated in air. The “off-to-on” transition in air was achieved by voltage sweeping enforced with a current-compliance operation that suppresses the overcurrent just after the change in tunneling resistance. It was also found that the applied voltages for the “on-to-off” resistance transition could be suppressed in air. These results imply that resistance switching is caused in air, and moreover, that the switching voltage is affected by the surroundings.

A 4k bits nonvolatile high-speed nanogap memory device was fabricated with a newly developed vertical nanogap structure and its memory characteristics were evaluated. The newly developed vertical nanogap structures realized controllable electrode gap and higher yield compared to the initial phase lateral type nanogap structure. The structures were integrated on a CMOS chip. The specially embedded measurement circuit revealed programming speed from a low resistance state to a high resistance state (from on to off state) to be 1 ns.Introduction One of the authors found that thin film metal electrodes with a gap less than 10 nm on an insulating substrate showed nonvolatile memory effect in vacuum [1]. Similar nanogap resistance change were widely observed for metals, such as Au, Pd, Pt, Ta [2], and even for Si [3] and carbon nanotubes [4] not only in vacuum but also in inert gases [10]. The current between the electrodes is due to electron tunneling. And the resistance corresponding to the gap distance was changed and controlled by applying voltage to the electrodes [5]. We have studied this phenomenon and applied for nonvolatile nanogap memory [8], because of its superior properties, i.e. high speed resistance switching, operation in a wide temperature range up to 200 C[1] and intrinsic high bit density. In this paper, results of integration of the nanogap memory (NGpM) on a CMOS LSI structure and evaluation of high speed switching capability using a specially embedded measurement circuit are reported.Fabrication NGpM is initially configured laterally on the insulating substrate as shown in Fig.1a, which is called as lateral type. It has been used to investigate the property and the mechanism of nanogap resistance change [1],[6], [7], however it is not suitable for memory array. We have developed various vertical type nanogap elements and finally adopted a trench type and a hole-in-line type each of which is shown in Fig.1b and 1c respectivly.[8] Using these types of nanogap element, a 4kb NGpM is integrated on a CMOS LSI in which transistors for each nanogap element selection, control circuits and the specially designed embedded measurement circuits were furnished. The technology of the CMOS LSI is 0.35 m high-voltage process of a foundry. Fabrication process on the chip is summarized in table 1. In this vertical type the gap distance between 1st and 2nd metal is determined by the spacer thickness, which is 10nm or less. The device size factor F is 40nm for hole-in-line type and 60nm for trench type. In the vertical type, the nanogap element is located at the cross point of upper and lower electrode, then 4F 2 is minimum size needed for a memory element. A nanogap element finer than 40nm also operates properly.[7] ProgrammingIn our previous work, it was very difficult to investigate the intrinsic programming speed of the nanogap elements, because of limitation of commercially available pulse generators with high-voltage high-speed drivability (10V, 10ns) and also an influence of the parasitic capacitance of lead p...

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As one of the candidates of a next-generation memory, we study the memory element using resistance change of the metal nanogap. Since this element has many advantages, for example, quite simple structure, wide material selectivity, high-speed programing, and high temperature tolerance. In this report, to realize miniaturization and mass production, vertical type nanogap elements were developed. As a result of measurements, the characteristic of vertical type is better than the element of lateral type. We studied switching speed of the elements and confirmed that the switching speed is under 50 ns.

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Silicon platforms were fabricated for optical modules and realize sub-micron precision using self-alignment process. This paper features a self-alignment process and use of precision platforms.