Antireflective (AR) coatings were prepared using a polyimide and two types of organically modified silica colloids via a solution casting method. The optically transparent polyimide was prepared from 2,2'-Bis [4-(3,4dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and 4,4 0 -oxydianiline (ODA). The silica colloids were driven to the coating-air interface by either the fluorinated alkyl group or PDMS (Polydimethylsiloxane) segment tethered onto the silica colloids. The amount of fluorinated alkyl groups and the molecular weight of the siloxane grafted on the silica colloid were varied. The PDMS-silica and fluorosilica colloids were characterized by TEM (Transmission Electron Microscopy), DLS (Dynamic Light Scattering), FTIR (Fourier Transform Infrared Spectroscopy), solid-state 13 C NMR (Nuclear Magnetic Resonance) and solid-state 29 Si NMR. The AR coatings were characterized by UV-vis (Ultraviolet-Visible Spectroscopy) transmittance spectra, AFM (Atomic Force Microscope), and SEM (Scanning Electron Microscope). The effects of modified silica loading and type of solvent on AR properties were studied. An enhancement in AR activity was observed for 1 wt% PDMS-modified (low molecular weight) silica coatings and 3 wt.% fluorosilica-10 in dimethylacetamide (DMAc). In comparison with cyclopentanone (CPT), DMAc favors migration of silica particles toward coating-air interface giving higher transmittance. The migration of particles to the surface and consequently increased surface roughness was observed by SEM.
In the past research, many scholars have been studying the harm of drinking. In this paper, through the method of establishing econometric model, by comparing the test statistics of each variable in the stepwise regression model, the stepwise regression analysis method is used to find out the most statistically significant model and study the relationship between the drinking frequency and the work intensity. Additionally, exploring how drinking frequency and working hours impact the economic development. Many other variables are selected to study the significance between themselves and the work intensity. The endogenous problem is also studied by using the appropriate tool variable "company" to solve this problem. Finally, it is concluded that there is a positive correlation between the work intensity and the drinking frequency.
The Bosch etch process is a critical process step used to create through silicon vias (TSVs) for 3D integrated circuit manufacturing. During the Bosch etch, a fluoropolymer passivation layer is formed on the sidewall of TSVs to help achieve a vertical profile and to protect the exposed dielectric materials. The fluoropolymer residue on the sidewalls in the TSVs must be removed prior to subsequent process steps. The highly fluorinated character of the fluorocarbon polymer residue makes its complete removal challenging due to characteristics such as limited solubility in solvents and slow or no reactivity with components of common cleaning or strip solutions. In this paper, the results of a study of solvents for developing formulations for removal of Bosch etch residue from TSVs are presented. The selection of components for an etch residue remover must take into consideration several key factors including removal efficiency, environmental-health-safety (EHS) guidelines, and material cost. The results demonstrate that the solvent selection has a dramatic impact on polymer removal efficiency, where poor solvent selection can lead to the formation of polymer balls inside the vias. The reported studies include cleaning results using a combination of polar solvents including protic and aprotic solvents, and amide and non-amide solvents. The cleaning performance is compared with a prediction using Hansen solubility parameters. Complete residue removal using TMAH-free and NMP-free formulations for TSV diameters down to 5 μm is demonstrated. Scanning electron microscopy, (SEM), energy-dispersive X-ray spectroscopy (EDS), and Auger electron spectroscopy (AES) were used to characterize the cleaning performance.
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