Process Variation (PV), Bias Temperature Instability (BTI) and Time-Dependent Dielectric Breakdown (TDDB) are the critical factors that affect the reliability of semiconductor chip design. They cause the system to be unstable and increase the soft error rate. In this paper, a compact on-chip degradation technique using runtime leakage current monitoring has been proposed. The proposed sensor-based adaptive technique compensates for the variation due to PV and aging using the body-bias-voltage-generator circuit. Simulation experiments for three and ten-year stress have been performed. Simulation results proved the superiority of the proposed sensor which provides 33% (up to 0.75 V) more output voltage and 98% sensitivity at 1 V supply voltage compared to the state-of-the-art sensor. The proposed technique mitigates up to 80% PV and BTI effects in SRAM compared to the state-of-the-art techniques.
We propose a novel ultra-low-power, voltage-based compute-in-memory (CIM) design with a new single-ended 8T SRAM bit cell structure. Since the proposed SRAM bit cell uses a single bitline for CIM calculation with decoupled read and write operations, it supports a much higher energy efficiency. In addition, to separate read and write operations, the stack structure of the read unit minimizes leakage power consumption. Moreover, the proposed bit cell structure provides better read and write stability due to the isolated read path, write path and greater pull-up ratio. Compared to the state-of-the-art SRAM-CIM, our proposed SRAM-CIM does not require extra transistors for CIM vector-matrix multiplication. We implemented a 16 k (128 × 128) bit cell array for the computation of 128× neurons, and used 64× binary inputs (0 or 1) and 64 × 128 binary weights (−1 or +1) values for the binary neural networks (BNNs). Each row of the bit cell array corresponding to a single neuron consists of a total of 128 cells, 64× cells for dot-product and 64× replicas cells for ADC reference. Additionally, 64× replica cells consist of 32× cells for ADC reference and 32× cells for offset calibration. We used a row-by-row ADC for the quantized outputs of each neuron, which supports 1–7 bits of output for each neuron. The ADC uses the sweeping method using 32× duplicate bit cells, and the sweep cycle is set to 2N−1+1, where N is the number of output bits. The simulation is performed at room temperature (27 °C) using 45 nm technology via Synopsys Hspice, and all transistors in bitcells use the minimum size considering the area, power, and speed. The proposed SRAM-CIM has reduced power consumption for vector-matrix multiplication by 99.96% compared to the existing state-of-the-art SRAM-CIM. Furthermore, because of the decoupled reading unit from an internal node of latch, there is no feedback from the reading unit, with read static noise, and margin-free results.
Automation of vehicles requires a secure, reliable, and real-time on-chip system. These systems also require very high-speed and compact on-chip analog to digital converters (ADC). The conventional ADC cannot fulfill this requirement. In this paper, we proposed a Darlington pair- and source biasing-based high speed, secure, and reliable voltage to time converter (VTC). It is a compact, high-speed design and gives high conversion gain. The source biasing also helps to increase the input voltage range. The conversion gain of the proposed circuit is 101.43ns/v, which is 52 times greater than the gain achieved by state-of-the-art design. It also shows less effect of process variation and bias temperature instability.
Voltage-to-time and current-to-time converters have been used in many recent works as a voltage-to-digital converter for artificial intelligence applications. In general, most of the previous designs use the current-starved technique or a capacitor-based delay unit, which is non-linear, expensive, and requires a large area. In this paper, we propose a highly linear current-to-digital converter. An optimization method is also proposed to generate the optimal converter design containing the smallest number of PMOS and sensitive circuits such as a differential amplifier. This enabled our design to be more stable and robust toward negative bias temperature instability (NBTI) and process variation. The proposed converter circuit implements the point-wise conversion from current-to-time, and it can be used directly for a variety of applications, such as analog-to-digital converters (ADC), used in built-in computational random access (C-RAM) memory. The conversion gain of the proposed circuit is 3.86 ms/A, which is 52 times greater than the conversion gains of state-of-the-art designs. Further, various time-to-digital converter (TDC) circuits are reviewed for the proposed current-to-time converter, and we recommend one circuit for a complete ADC design.
Deep neural networks (DNNs) and Convolutional neural networks (CNNs) have improved accuracy in many Artificial Intelligence (AI) applications. Some of these applications are recognition and detection tasks, such as speech recognition, facial recognition and object detection. On the other hand, CNN computation requires complex arithmetic and a lot of memory access time; thus, designing new hardware that would increase the efficiency and throughput without increasing the hardware cost is much more critical. This area in hardware design is very active and will continue to be in the near future. In this paper, we propose a novel 8T XNOR-SRAM design for Binary/Ternary DNNs (TBNs) directly supporting the XNOR-Network and the TBN DNNs. The proposed SRAM Computing-in-Memory (CIM) can operate in two modes, the first of which is the conventional 6T SRAM, and the second is the XNOR mode. By adding two extra transistors to the conventional 6T structure, our proposed CIM showed an improvement up to 98% for power consumption and 90% for delay compared to the existing state-of-the-art XNOR-CIM.
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