An MCP(Multi-chip Package) is a package consisting of several chips. Since several chips are stacked on the same substrate, multiple assembly steps are required to make an MCP. The characteristics of the chips in the MCP are dependent on the layer sequence. In the MCP manufacturing process, it is very essential to carefully consider the layer sequence in scheduling to achieve the intended throughput as well as the WIP balance. In this paper, we propose a scheduling methodology considering the layer sequence constraint.
This paper discusses a scheduling problem with delay time constraint arising in the semiconductor manufacturing. The delay time constraint means that a process should be started within delay time from the start step of the process. It becomes more critical to determine the FAB yield and product quality. This paper examines scheduling and control problem for semiconductor manufacturing which has time constrained processes. We classify the problem into 3 levels and propose the solution algorithm for each problem. We also explain how to integrate our MES system for the problem.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.