Ferroelectric memory devices are expected for low-power and high-speed memory applications. HfO2-based ferroelectric is attracting attention for its CMOS-compatibility and high scalability. Mesoscopic-scale grains, of which size is almost comparable to device size, are formed in HfO2-based ferroelectric poly-crystalline thin films, which largely influences electrical characteristics in memory devices. It is important to study the impact of mesoscopic-scale grain formation on the electrical characteristics. In this work, first, we have studied the thickness dependence of the polarization switching kinetics in HfO2-based ferroelectric. While static low-frequency polarization is comparable for different thickness, dynamic polarization switching speed is slower in thin Hf0.5Zr0.5O2 (HZO) capacitors. Based on the analysis using the NLS model and physical characterization, thinner HZO contains smaller grains with orientation non-uniformity and more grain boundaries than thicker HZO, which can impede macroscopic polarization switching. We have also theoretically and experimentally studied the polar-axis alignment of a HfO2-based ferroelectric thin film. While in-plane polar orientation is stable in as-grown HZO, out-of-plane polarization can be dominant by applying electric field, which indicates the transition from in-plane polar to out-of-plane polar orientation in the ferroelectric phase grains. This is confirmed by calculating kinetic pathway using ab-initio calculation.

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HfO2-based ferroelectric (FE–HfO2) is a promising material for low-power and high-capacity memory technology. Since thinner ferroelectric films are required for low voltage operation, the impact of film thickness on the switching kinetics of FE–HfO2 needs to be studied in detail. In this paper, metal/ferroelectric/metal capacitors are fabricated with several thicknesses of HfZrO2 (HZO) films and characterized to study the switching kinetics based on the nucleation limited switching (NLS) model. Thinner HZO capacitors show slower polarization switching and asymmetry in program and erase operation, although low-frequency polarization charge density is nearly the same for all thicknesses. Slow switching is due to the large variability of the activation field of FE domains and grain boundaries among small FE grains. The asymmetry is caused by the asymmetric interface property at the top and bottom interfaces. High-resolution TEM and electron diffraction mapping methods provide physical evidence for the above discussions.

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