Stress of encapsuant resin which acts on LSI chip was measured to evaluate passivation defects by a new method. It was cleared that the resin thermal stress gave damage to the LSI passivation film and aluminum corrosion took place by moisture penetrating through the film damage up to the metal surface in a humid atmosphere.The stress values obtained by the new method for various resins showed good correlation to the passivation defect densities. When a resin with half stress was applied, the defect density was halved.To improve the moisture resistance of plastic-encapsulated LSIs, the application of the low stress resin is supposed to be a good method.
This study empirically examines the relationship between clamp force and pull-out strength in lag screw joints of timber members, using data obtained in tightening tests and pull-out tests. Maximum clamp force per unit screw length as determined from the tightening tests was lower than the lower bound for the 95% tolerance range for pull-out strength per unit screw length as determined from the pull-out tests. Moreover, X-ray CT (computed tomography) observations of anchor members from both tests revealed that failure behavior clearly differed between the tightening test and the pull-out test: tightening caused damage to the wooden, female thread in addition to major splitting damage in the wood perpendicular to the grain near the tip of the lag screw.
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