Copper-based diamond composites have been the focus of many investigations for higher thermal conductivity applications. However, the natural non-wetting behavior between diamond particles and copper matrix makes it difficult to fabricate copper-based diamond composites with high thermal conductivity. Thus, to promote wettability between copper and diamond particles, the copper/diamond interface must be modified by coating alloying elements on the diamond surface or by adding active alloying elements with carbon in the copper matrix. In this paper, we review the research progress on copper-based diamond composites, including theoretical models for calculating the thermal conductivity and the effect of process parameters on the thermal conductivity of copper-based diamond composites. The factors that affect interfacial thermal conductivity are emphatically analyzed in this review. Finally, the current problems of copper-based diamond composites and future research trends are recommended.
Supercritical carbon dioxide (S-CO2) has the advantages of amphoteric liquid and gas, which possesses many unique characteristics, such as good compressibility, high density, high solubility, good fluidity and low viscosity. The Brayton cycle with S-CO2 is considered to have many promising applications, especially for power conversion industries. However, the corrosion and degradation of structural materials hinder the development and application of the Brayton cycle with S-CO2. Nickel-based alloys have the best corrosion resistance in S-CO2 environments compared to austenitic stainless steels and ferritic/martensitic steels. Thus, the present article mainly reviews the corrosion behaviour of nickel-based alloys in S-CO2 under high temperature and pressure. The effect of alloying elements and environment parameters on the corrosion behaviour of different nickel-based alloys are systematically summarized. The conclusion and outlook are given at the end.
Thermal stability of samples deformed by equal channel angular pressing (ECAP) using route BC and B135 was studied. The new route B135 was developed by defining 135° clockwise rotation of samples in each pass. After ECAP processing, samples were heat treated at different temperatures for a period of time. The effect of the two different routes on thermal stability of the ECAPed samples was investigated in detail. Electron backscatter diffraction was used to detect the processes of both recovery and recrystallization during thermal processing. Also, the effect of extrusion route on thermal stability of the deformed samples was further investigated by microhardness measurements.
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